下一代DFM[半导体制造]

K. P. White, W. Trybula
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引用次数: 3

摘要

许多现有的布局、建模和仿真工具都可以看作是半导体制造设计系统(DFSM)的组成部分。本文简要回顾了半导体器件复杂性的增加,相关半导体设计工具的范围,以及未来制造需求与预计设计能力之间日益扩大的差距。我们还研究了为制造而设计(DFM)作为一种生产哲学在其他行业的出现,并考虑了DFM可能学到的经验教训。其含义是,如果要维持半导体生产率的历史增长,就需要加速改进。DFSM的现有工作已经显示出希望,但需要做的还有很多。组件设计工具的开发进展滞后,并且在很大程度上缺乏将这些工具集成到DFSM的连贯系统中。对DFSM工具的未来开发工作提出了建议。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
DFM for the next generation [semiconductor manufacturing]
Many existing layout, modeling, and simulation tools can be thought of as components of a de facto system of design for semiconductor manufacturing (DFSM). This paper briefly reviews the increase in complexity of semiconductor devices, the spectrum of relevant semiconductor design tools, and the widening gap between future manufacturing needs and projected design capabilities. We also examine the emergence of design for manufacture (DFM) as a production philosophy in other industries and consider the lessons that might be learned for DFSM. The implications are that there is a need for accelerated improvements if historical semiconductor productivity growth is to be sustained. The existing work in DFSM has shown promise, but much more needs to be done. Advances in the development of component design tools are lagging and integration of these tools into a coherent system for DFSM is largely lacking. Suggestions for future development efforts of DFSM tools are offered.
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