V. Milusheva, M. Georgieva, B. Tzaneva, M. Petrova
{"title":"铝基阳极氧化铝化学镀铜","authors":"V. Milusheva, M. Georgieva, B. Tzaneva, M. Petrova","doi":"10.1109/ET.2018.8549651","DOIUrl":null,"url":null,"abstract":"In this work a technology for electroless copper deposition into nanoporous anodic aluminium oxide on copper metalized aluminium substrate was realized. The immersion copper layer on AI/AAO interface was used to catalyse the electroless plating. The characterization of the obtained copper layers was accomplished by optical and scanning electron microscopy, energy-dispersive X-ray and X-ray diffraction analysis.","PeriodicalId":374877,"journal":{"name":"2018 IEEE XXVII International Scientific Conference Electronics - ET","volume":"62 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Electroless Copper Deposition into Anodic Aluminium Oxide on Aluminum Substrate\",\"authors\":\"V. Milusheva, M. Georgieva, B. Tzaneva, M. Petrova\",\"doi\":\"10.1109/ET.2018.8549651\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work a technology for electroless copper deposition into nanoporous anodic aluminium oxide on copper metalized aluminium substrate was realized. The immersion copper layer on AI/AAO interface was used to catalyse the electroless plating. The characterization of the obtained copper layers was accomplished by optical and scanning electron microscopy, energy-dispersive X-ray and X-ray diffraction analysis.\",\"PeriodicalId\":374877,\"journal\":{\"name\":\"2018 IEEE XXVII International Scientific Conference Electronics - ET\",\"volume\":\"62 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE XXVII International Scientific Conference Electronics - ET\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ET.2018.8549651\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE XXVII International Scientific Conference Electronics - ET","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ET.2018.8549651","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electroless Copper Deposition into Anodic Aluminium Oxide on Aluminum Substrate
In this work a technology for electroless copper deposition into nanoporous anodic aluminium oxide on copper metalized aluminium substrate was realized. The immersion copper layer on AI/AAO interface was used to catalyse the electroless plating. The characterization of the obtained copper layers was accomplished by optical and scanning electron microscopy, energy-dispersive X-ray and X-ray diffraction analysis.
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