微工程传感器:综述

D. Misra, W. Carr
{"title":"微工程传感器:综述","authors":"D. Misra, W. Carr","doi":"10.1109/ELECTR.1991.718181","DOIUrl":null,"url":null,"abstract":"Recently the application of bulk and surface processing of silicon related materials has made it possible to successfully fabricate micromechanical structures in the range of 0.5 to 500 microns, which exhibits unrestrained motion over at least one degree of freedom. The sculptural fabrication techniques can be used to realize a variety of measurement devices (microengineered sensors). This paper describes the recent developments in the area of design, fabrication and operation of these microengineered sensors. The possible integration of the sensing elements with the signal processing circuit on one chip (the so called smart sensors) is also being discussed briefly.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Microengineered Sensors: A Review\",\"authors\":\"D. Misra, W. Carr\",\"doi\":\"10.1109/ELECTR.1991.718181\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Recently the application of bulk and surface processing of silicon related materials has made it possible to successfully fabricate micromechanical structures in the range of 0.5 to 500 microns, which exhibits unrestrained motion over at least one degree of freedom. The sculptural fabrication techniques can be used to realize a variety of measurement devices (microengineered sensors). This paper describes the recent developments in the area of design, fabrication and operation of these microengineered sensors. The possible integration of the sensing elements with the signal processing circuit on one chip (the so called smart sensors) is also being discussed briefly.\",\"PeriodicalId\":339281,\"journal\":{\"name\":\"Electro International, 1991\",\"volume\":\"31 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1991-04-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electro International, 1991\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ELECTR.1991.718181\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electro International, 1991","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ELECTR.1991.718181","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

近年来,硅相关材料的体加工和表面加工的应用使得成功制造0.5至500微米范围内的微机械结构成为可能,这些结构在至少一个自由度上表现出不受约束的运动。雕塑制造技术可用于实现各种测量装置(微工程传感器)。本文介绍了这些微工程传感器在设计、制造和操作方面的最新进展。将传感元件与信号处理电路集成在一块芯片上(即所谓的智能传感器)的可能性也进行了简要讨论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Microengineered Sensors: A Review
Recently the application of bulk and surface processing of silicon related materials has made it possible to successfully fabricate micromechanical structures in the range of 0.5 to 500 microns, which exhibits unrestrained motion over at least one degree of freedom. The sculptural fabrication techniques can be used to realize a variety of measurement devices (microengineered sensors). This paper describes the recent developments in the area of design, fabrication and operation of these microengineered sensors. The possible integration of the sensing elements with the signal processing circuit on one chip (the so called smart sensors) is also being discussed briefly.
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