Bei Li, Zhaohui Wu, J. Deng, D. Dai, Bin Li, Qiang Su, Yangyang Peng
{"title":"可重构射频前端的功率放大器与Saw滤波器集成设计","authors":"Bei Li, Zhaohui Wu, J. Deng, D. Dai, Bin Li, Qiang Su, Yangyang Peng","doi":"10.1109/ISNE.2019.8896447","DOIUrl":null,"url":null,"abstract":"In order to make the RF front-end more compact and efficient, a chip integrating surface acoustic wave (SAW) filters and a reconfigurable multi-frequency multi-mode power amplifier (MMPA) was designed. Taped out and the test results showed that: the EUTRAACLR1 of the integrated chip is decreased by 0.54dBc compared to the discrete connections, the UTRAACLR1 is decreased by 1.33dBc, the ICC is decreased by 43.5mA, the PAE is increased by 0.55% and the Gain is increased by 0.32dB. Reliability Electrostatic test and aging test meet the production requirements.","PeriodicalId":405565,"journal":{"name":"2019 8th International Symposium on Next Generation Electronics (ISNE)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Integrated Design of Power Amplifier and Saw Filters for Reconfigurable RF Front-end\",\"authors\":\"Bei Li, Zhaohui Wu, J. Deng, D. Dai, Bin Li, Qiang Su, Yangyang Peng\",\"doi\":\"10.1109/ISNE.2019.8896447\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In order to make the RF front-end more compact and efficient, a chip integrating surface acoustic wave (SAW) filters and a reconfigurable multi-frequency multi-mode power amplifier (MMPA) was designed. Taped out and the test results showed that: the EUTRAACLR1 of the integrated chip is decreased by 0.54dBc compared to the discrete connections, the UTRAACLR1 is decreased by 1.33dBc, the ICC is decreased by 43.5mA, the PAE is increased by 0.55% and the Gain is increased by 0.32dB. Reliability Electrostatic test and aging test meet the production requirements.\",\"PeriodicalId\":405565,\"journal\":{\"name\":\"2019 8th International Symposium on Next Generation Electronics (ISNE)\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 8th International Symposium on Next Generation Electronics (ISNE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISNE.2019.8896447\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 8th International Symposium on Next Generation Electronics (ISNE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISNE.2019.8896447","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Integrated Design of Power Amplifier and Saw Filters for Reconfigurable RF Front-end
In order to make the RF front-end more compact and efficient, a chip integrating surface acoustic wave (SAW) filters and a reconfigurable multi-frequency multi-mode power amplifier (MMPA) was designed. Taped out and the test results showed that: the EUTRAACLR1 of the integrated chip is decreased by 0.54dBc compared to the discrete connections, the UTRAACLR1 is decreased by 1.33dBc, the ICC is decreased by 43.5mA, the PAE is increased by 0.55% and the Gain is increased by 0.32dB. Reliability Electrostatic test and aging test meet the production requirements.
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