Jl Leou, Vincent Chen, Jj Chen, Thomas Wang, Harrison Chang
{"title":"采用新型多隔室屏蔽的小型化LTE调制解调器SiP","authors":"Jl Leou, Vincent Chen, Jj Chen, Thomas Wang, Harrison Chang","doi":"10.1109/ICSJ.2014.7009607","DOIUrl":null,"url":null,"abstract":"This paper describes a miniaturized LTE SiP modem target for the smallest form factor among the product category. A Novel compartment shielding process is used to implement multiple shielded areas to reduce the interference between digital, analog and RF circuits. The result shows that this modem has excellent RF performance and meets all 3GPP LTE Category 3 (downlink speed can reach 100Mbps) and carrier's requirements. This SiP module passed FCC and CE EMI regulatory tests, and also passed GCF and PTCRB certification. Also, the reliability test shows this process meets consumer applications such as LTE modem for tablet. It is found that this compartment shielding process is good for consumer grade SiP module both in technology and in commercial terms.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Miniaturized LTE modem SiP using novel multiple compartments shielding\",\"authors\":\"Jl Leou, Vincent Chen, Jj Chen, Thomas Wang, Harrison Chang\",\"doi\":\"10.1109/ICSJ.2014.7009607\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes a miniaturized LTE SiP modem target for the smallest form factor among the product category. A Novel compartment shielding process is used to implement multiple shielded areas to reduce the interference between digital, analog and RF circuits. The result shows that this modem has excellent RF performance and meets all 3GPP LTE Category 3 (downlink speed can reach 100Mbps) and carrier's requirements. This SiP module passed FCC and CE EMI regulatory tests, and also passed GCF and PTCRB certification. Also, the reliability test shows this process meets consumer applications such as LTE modem for tablet. It is found that this compartment shielding process is good for consumer grade SiP module both in technology and in commercial terms.\",\"PeriodicalId\":362502,\"journal\":{\"name\":\"IEEE CPMT Symposium Japan 2014\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE CPMT Symposium Japan 2014\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICSJ.2014.7009607\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE CPMT Symposium Japan 2014","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSJ.2014.7009607","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Miniaturized LTE modem SiP using novel multiple compartments shielding
This paper describes a miniaturized LTE SiP modem target for the smallest form factor among the product category. A Novel compartment shielding process is used to implement multiple shielded areas to reduce the interference between digital, analog and RF circuits. The result shows that this modem has excellent RF performance and meets all 3GPP LTE Category 3 (downlink speed can reach 100Mbps) and carrier's requirements. This SiP module passed FCC and CE EMI regulatory tests, and also passed GCF and PTCRB certification. Also, the reliability test shows this process meets consumer applications such as LTE modem for tablet. It is found that this compartment shielding process is good for consumer grade SiP module both in technology and in commercial terms.
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