热导率对SMT回流焊工艺的影响

P. Svasta, D. Simion-Zanescu, C. Willi
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引用次数: 6

摘要

SMD元件最常用的焊接工艺之一是回流焊工艺。对于pcb,人们应该期待元件密度和互连密度的增加以及元件尺寸和重量的不断减小。众所周知,在元件引脚和相应焊盘之间的连接点上的温度分布对于适当的焊接过程是多么重要。回流炉内的温度分布主要是对流和辐射两种方式实现的。一般的热传导是研究结构对环境的耗散特性。如果SMT组装相反,回流炉内部环境对组装结构的影响。部件的传热方式和物理性能对获得可靠的产品非常重要;“零缺陷”。本文有两个主要目标。首先,提出了一种简单的根据烤箱几何形状绘制加热器分布图的方法。这对于数学建模、计算和/或模拟是必要的。第二部分将着重介绍这种方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermal conductivity influence in SMT reflow soldering process
One of the most used soldering processes for SMD components is the reflow process. For the PCBs one should expect the increasing of the components density and interconnection density together with the continuous reducing of component size and weight. It is well known how important it is for a proper soldering process to have the temperature distribution on the junction point between component pins and the corresponding pads. Mainly convection and radiation realize the temperature distribution in the reflow oven. Usual thermal conduction is treated to study the dissipation characteristics from a structure to the environment. In case of SMT assembly it is reversed, the influence of inside environment of a reflow oven acts on the assembled structure. The way of heat transfer and physical properties of the subassemblies are very important to obtain reliable product; "zero defects". The paper has two main goals. First, to present a simple method to realize a map of heaters according with the oven's geometrical profile. This is necessary for mathematical modeling, computing and/or simulation. In the second part this method will be emphasized.
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