C. Choi, M. W. Lee, J. Sung, Bo-Soon Kim, Seung-Gol Lee, B. O
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Residual Layer Distribution on Embossing Process for Photonic Devices
We report on the behavior and effect of the residual layer left on the substrate after embossing process for the fabrication of photonic devices. The PDMS material was used as mold, and thermal and UV curable polymers was adapted for the fabrication of demultiplexer and optical power splitter, respectively.