{"title":"锡膏熔化的实验研究","authors":"V. Tsenev, V. Videkov","doi":"10.1109/ET.2017.8124397","DOIUrl":null,"url":null,"abstract":"The report presents the results of a study of the melting of various solder pastes. The temperature distribution over time with convection heating, conductive and radiant was investigated. Sources of different heat output and different heating speeds were used. The results of cooling the paste are also presented.","PeriodicalId":127983,"journal":{"name":"2017 XXVI International Scientific Conference Electronics (ET)","volume":"190 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Experimental study of the melting of a solder paste\",\"authors\":\"V. Tsenev, V. Videkov\",\"doi\":\"10.1109/ET.2017.8124397\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The report presents the results of a study of the melting of various solder pastes. The temperature distribution over time with convection heating, conductive and radiant was investigated. Sources of different heat output and different heating speeds were used. The results of cooling the paste are also presented.\",\"PeriodicalId\":127983,\"journal\":{\"name\":\"2017 XXVI International Scientific Conference Electronics (ET)\",\"volume\":\"190 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 XXVI International Scientific Conference Electronics (ET)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ET.2017.8124397\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 XXVI International Scientific Conference Electronics (ET)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ET.2017.8124397","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Experimental study of the melting of a solder paste
The report presents the results of a study of the melting of various solder pastes. The temperature distribution over time with convection heating, conductive and radiant was investigated. Sources of different heat output and different heating speeds were used. The results of cooling the paste are also presented.
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