大容量无线通信的封装要求

1992 IEEE Microwave Symposium Digest MTT-S Pub Date : 1992-06-01 DOI:10.1109/MWSYM.1992.188297

D. R. Green, J.P. Beccone, R.B. Crispell

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引用次数: 3

摘要

只提供摘要形式。作者概述了目前和预期的大量无线通信应用，重点是蜂窝和无绳电话，用于mmic(单片微波集成电路)和mic。讨论了现有和新兴标准的包装要求。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Packaging requirements for high volume wireless communications

Summary form only given. The authors presented an overview of present and anticipated high-volume wireless communication applications, with emphasis on cellular and cordless phones, for MMICs (monolithic microwave integrated circuits) and MICs. The packaging requirements are discussed for existing and emerging standards.<>

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来源期刊

1992 IEEE Microwave Symposium Digest MTT-S

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