808 nm gaas基大功率激光二极管光输出温度衰减研究

2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME) Pub Date : 2020-05-01 DOI:10.1109/ICEDME50972.2020.00033

Tieying Hao, Shiwei Feng, Xiang Zheng, Kun Bai

{"title":"808 nm gaas基大功率激光二极管光输出温度衰减研究","authors":"Tieying Hao, Shiwei Feng, Xiang Zheng, Kun Bai","doi":"10.1109/ICEDME50972.2020.00033","DOIUrl":null,"url":null,"abstract":"The degradation mechanism of 808nm GaAs-based high-power laser diode bars (LDBs) with 6 single laser diodes was investigated using infrared thermography and photoemission microscopy. Over time, measurements of output power indicated that one of the 6 laser bars had a serious degradation of output power. Infrared imaging and photoemission microscopy revealed that solder voids during packaging resulted in premature failure due to high temperatures in the lasing region. The current reliability of LDB devices is compromised by these packaging defects.","PeriodicalId":155375,"journal":{"name":"2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The study of temperature-dependent degradation of optical output on 808 nm GaAs-Based High-Power Laser Diode Bars\",\"authors\":\"Tieying Hao, Shiwei Feng, Xiang Zheng, Kun Bai\",\"doi\":\"10.1109/ICEDME50972.2020.00033\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The degradation mechanism of 808nm GaAs-based high-power laser diode bars (LDBs) with 6 single laser diodes was investigated using infrared thermography and photoemission microscopy. Over time, measurements of output power indicated that one of the 6 laser bars had a serious degradation of output power. Infrared imaging and photoemission microscopy revealed that solder voids during packaging resulted in premature failure due to high temperatures in the lasing region. The current reliability of LDB devices is compromised by these packaging defects.\",\"PeriodicalId\":155375,\"journal\":{\"name\":\"2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEDME50972.2020.00033\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEDME50972.2020.00033","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

采用红外热像仪和光电显微镜研究了6个单激光二极管对808nm gaas基大功率激光二极管棒(ldb)的降解机理。随着时间的推移，对输出功率的测量表明，6个激光棒中的一个输出功率严重下降。红外成像和光电发射显微镜显示，由于激光区域的高温，封装过程中的焊料空洞导致过早失效。目前LDB器件的可靠性受到这些封装缺陷的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

The study of temperature-dependent degradation of optical output on 808 nm GaAs-Based High-Power Laser Diode Bars

The degradation mechanism of 808nm GaAs-based high-power laser diode bars (LDBs) with 6 single laser diodes was investigated using infrared thermography and photoemission microscopy. Over time, measurements of output power indicated that one of the 6 laser bars had a serious degradation of output power. Infrared imaging and photoemission microscopy revealed that solder voids during packaging resulted in premature failure due to high temperatures in the lasing region. The current reliability of LDB devices is compromised by these packaging defects.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)

自引率

0.00%

发文量