高级功能约束对可测试性的影响

Jaushin Lee, V. Chickermane, J. Patel
{"title":"高级功能约束对可测试性的影响","authors":"Jaushin Lee, V. Chickermane, J. Patel","doi":"10.1109/VTEST.1993.313364","DOIUrl":null,"url":null,"abstract":"When a logic module is embedded in a large circuit, the architectural level functional constraints usually cause don't cares at the interface of this module. If the logic of the module is not synthesized using these don't cares, then redundancy may exist making the circuit very hard to test. In this paper, architectural level circuit structural and instruction behavioral information is exploited to analyze functional constraints and extract don't cares. The don't cares are used to optimize the logic of the module and to remove many redundant faults.<<ETX>>","PeriodicalId":283218,"journal":{"name":"Digest of Papers Eleventh Annual 1993 IEEE VLSI Test Symposium","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-04-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Impact of high level functional constraints on testability\",\"authors\":\"Jaushin Lee, V. Chickermane, J. Patel\",\"doi\":\"10.1109/VTEST.1993.313364\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"When a logic module is embedded in a large circuit, the architectural level functional constraints usually cause don't cares at the interface of this module. If the logic of the module is not synthesized using these don't cares, then redundancy may exist making the circuit very hard to test. In this paper, architectural level circuit structural and instruction behavioral information is exploited to analyze functional constraints and extract don't cares. The don't cares are used to optimize the logic of the module and to remove many redundant faults.<<ETX>>\",\"PeriodicalId\":283218,\"journal\":{\"name\":\"Digest of Papers Eleventh Annual 1993 IEEE VLSI Test Symposium\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-04-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Digest of Papers Eleventh Annual 1993 IEEE VLSI Test Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VTEST.1993.313364\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Digest of Papers Eleventh Annual 1993 IEEE VLSI Test Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VTEST.1993.313364","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

当一个逻辑模块被嵌入到一个大型电路中时,架构层面的功能限制通常会导致不关心该模块的接口。如果模块的逻辑不使用这些不关心合成,那么冗余可能存在,使电路很难测试。本文利用体系结构层的电路结构和指令行为信息来分析功能约束,提取无关约束。don't care用于优化模块的逻辑,并去除许多冗余故障
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Impact of high level functional constraints on testability
When a logic module is embedded in a large circuit, the architectural level functional constraints usually cause don't cares at the interface of this module. If the logic of the module is not synthesized using these don't cares, then redundancy may exist making the circuit very hard to test. In this paper, architectural level circuit structural and instruction behavioral information is exploited to analyze functional constraints and extract don't cares. The don't cares are used to optimize the logic of the module and to remove many redundant faults.<>
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