{"title":"电子设备强制空气冷却的实际限制","authors":"M. E. Jacobs","doi":"10.1109/INTLEC.1989.88243","DOIUrl":null,"url":null,"abstract":"Cooling with forced air is analyzed from a general perspective. It is demonstrated that there are physical processes that limit the maximum dissipation of heat from a frame or shelf of electronic equipment. These constraints are shown to arise from the limitations on allowable acoustic noise. Some results from fluid mechanics are used to construct a pressure-flow model of heat removal. Two problems of determining maximum heat dissipation are then described. In the first, the maximum dissipation in a fan-cooled shelf is derived subject to an acoustic noise constraint. In the second problem, a shelf of circuit cards is examined for which the pressure drop is already given. For this case the maximum dissipation is derived and shown to be proportional to the square-root of pressure and to the top area of the shelf. It is noted that both of these results are essential in designing new system and in specifying high-dissipation elements such as power supplies.<<ETX>>","PeriodicalId":272740,"journal":{"name":"Conference Proceedings., Eleventh International Telecommunications Energy Conference","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"The practical limits of forced-air cooling of electronic equipment\",\"authors\":\"M. E. Jacobs\",\"doi\":\"10.1109/INTLEC.1989.88243\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Cooling with forced air is analyzed from a general perspective. It is demonstrated that there are physical processes that limit the maximum dissipation of heat from a frame or shelf of electronic equipment. These constraints are shown to arise from the limitations on allowable acoustic noise. Some results from fluid mechanics are used to construct a pressure-flow model of heat removal. Two problems of determining maximum heat dissipation are then described. In the first, the maximum dissipation in a fan-cooled shelf is derived subject to an acoustic noise constraint. In the second problem, a shelf of circuit cards is examined for which the pressure drop is already given. For this case the maximum dissipation is derived and shown to be proportional to the square-root of pressure and to the top area of the shelf. It is noted that both of these results are essential in designing new system and in specifying high-dissipation elements such as power supplies.<<ETX>>\",\"PeriodicalId\":272740,\"journal\":{\"name\":\"Conference Proceedings., Eleventh International Telecommunications Energy Conference\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1989-10-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Conference Proceedings., Eleventh International Telecommunications Energy Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/INTLEC.1989.88243\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference Proceedings., Eleventh International Telecommunications Energy Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/INTLEC.1989.88243","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The practical limits of forced-air cooling of electronic equipment
Cooling with forced air is analyzed from a general perspective. It is demonstrated that there are physical processes that limit the maximum dissipation of heat from a frame or shelf of electronic equipment. These constraints are shown to arise from the limitations on allowable acoustic noise. Some results from fluid mechanics are used to construct a pressure-flow model of heat removal. Two problems of determining maximum heat dissipation are then described. In the first, the maximum dissipation in a fan-cooled shelf is derived subject to an acoustic noise constraint. In the second problem, a shelf of circuit cards is examined for which the pressure drop is already given. For this case the maximum dissipation is derived and shown to be proportional to the square-root of pressure and to the top area of the shelf. It is noted that both of these results are essential in designing new system and in specifying high-dissipation elements such as power supplies.<>