{"title":"用全波方法模拟印刷电路互连的射频电压降","authors":"E. Chua, K. See, Zhihong Liu","doi":"10.1109/EMCZUR.2006.214938","DOIUrl":null,"url":null,"abstract":"Based on the method of moments (MoM) approach, the radio frequency (RF) voltage drop at any two points of printed circuit interconnects is modeled. The proposed modeling method has been validated experimentally with close agreement. The proposed method allows further study of the impact of RF voltage drop of interconnects on circuit functionality as well as EMI performance","PeriodicalId":130489,"journal":{"name":"2006 17th International Zurich Symposium on Electromagnetic Compatibility","volume":"698 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Modeling RF voltage drop of printed circuit interconnects using a full-wave approach\",\"authors\":\"E. Chua, K. See, Zhihong Liu\",\"doi\":\"10.1109/EMCZUR.2006.214938\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Based on the method of moments (MoM) approach, the radio frequency (RF) voltage drop at any two points of printed circuit interconnects is modeled. The proposed modeling method has been validated experimentally with close agreement. The proposed method allows further study of the impact of RF voltage drop of interconnects on circuit functionality as well as EMI performance\",\"PeriodicalId\":130489,\"journal\":{\"name\":\"2006 17th International Zurich Symposium on Electromagnetic Compatibility\",\"volume\":\"698 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-05-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 17th International Zurich Symposium on Electromagnetic Compatibility\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMCZUR.2006.214938\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 17th International Zurich Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCZUR.2006.214938","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Modeling RF voltage drop of printed circuit interconnects using a full-wave approach
Based on the method of moments (MoM) approach, the radio frequency (RF) voltage drop at any two points of printed circuit interconnects is modeled. The proposed modeling method has been validated experimentally with close agreement. The proposed method allows further study of the impact of RF voltage drop of interconnects on circuit functionality as well as EMI performance