知识产权整合:过去、现在和未来

R. Boumaza, Fateh Boutekkouk
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引用次数: 0

摘要

由于片上系统及其组件的复杂性日益增加,知识产权(ip)集成变得越来越具有挑战性。由于没有关于该主题的调查,因此撰写本文是为了帮助最近对该领域感兴趣的研究人员了解IP集成。本文试图阐明随着时间的推移,知识产权整合面临的挑战,以及研究人员和工业界是如何应对每一项挑战的。另一方面,用于封装、集成和重用知识产权的标准IP-XACT的出现,促进了许多集成工具的开发和现有工具的增强。在这方面,本文在标准出现之前和之后提出了不同的解决方案,并对不同的建议解决方案进行了讨论,包括尝试定义需要做什么。最后,本文总结了一个有希望的趋势,希望能缓解一些知识产权整合的差距。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Intellectual Properties Integration: The Past, the Present, and the Future
Intellectual properties (IPs) integration is becoming more challenging due to the increasing complexity of systems on chip as well as their components. Since no survey is available about this topic, this paper is written to help recently interested researchers in the field to have an idea about IP integration. This paper tries to put the light on IP integration challenges over time and how researchers and industrials have dealt with every challenge. On the other hand, the emergence of the standard IP-XACT for packaging, integrating, and reusing intellectual properties has enabled the development of many integration tools and the enhancement of the already existing ones. In this regard, different solutions are presented in this paper before and after the emergence of the standard enriched with a discussion of different proposed solutions including an attempt to define what is needed to be done else. At the end, the paper concludes by considering a promising tendency that hopefully will mitigate some of IP integration gaps.
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