粗糙接触面上三阶无机互调的模拟

Yan Li, Yang Shi, Zhi-yi Gao, Hao-Nan Zhou, Chuang-Chuang Fang, W. Tian
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引用次数: 0

摘要

本文分析了金属接触面无源互调的机理。根据粗糙度接触模型,建立了相应的等效电路模型。利用ADS进行了数值模拟,研究了金属接触面粗糙度、接触面积、机械载荷和励磁电磁场强度对无源互调功率的影响,提出了工程应用中减少无源互调产物的抑制措施。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Simulation of Third-order Inorganic Intermodulation on a Rough Contact Surface
In this paper, the mechanism of passive intermodulation on the metal contact surface is analyzed. According to the roughness contact model, the corresponding equivalent circuit model is established. The influence of metal contact surface roughness, contact area, mechanical loading, and excitation electromagnetic field strength on passive intermodulation power is studied with numerical simulation using ADS. The suppression measures to reduce passive intermodulation products in engineering applications are proposed.
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