{"title":"真空断路器用Cu-Cr触头材料的现状及发展趋势","authors":"B. Miao, Yan Zhang, Guoxun Liu","doi":"10.1109/DEIV.2004.1422608","DOIUrl":null,"url":null,"abstract":"This paper briefly reviews the Cu-Cr materials which are widely adopted for contacts in medium-voltage, high current vacuum circuit breakers (VCB). It is shown that microstructure is a strategic link between the processing and properties of the contact materials, and why the quality and performance of Cn-Cr alloy contact materials are superior to that of CuCr p/m contact materials.","PeriodicalId":137370,"journal":{"name":"XXIst International Symposium on Discharges and Electrical Insulation in Vacuum, 2004. Proceedings. ISDEIV.","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":"{\"title\":\"Current status and developing trends of Cu-Cr contact materials for VCB\",\"authors\":\"B. Miao, Yan Zhang, Guoxun Liu\",\"doi\":\"10.1109/DEIV.2004.1422608\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper briefly reviews the Cu-Cr materials which are widely adopted for contacts in medium-voltage, high current vacuum circuit breakers (VCB). It is shown that microstructure is a strategic link between the processing and properties of the contact materials, and why the quality and performance of Cn-Cr alloy contact materials are superior to that of CuCr p/m contact materials.\",\"PeriodicalId\":137370,\"journal\":{\"name\":\"XXIst International Symposium on Discharges and Electrical Insulation in Vacuum, 2004. Proceedings. ISDEIV.\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"20\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"XXIst International Symposium on Discharges and Electrical Insulation in Vacuum, 2004. Proceedings. ISDEIV.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DEIV.2004.1422608\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"XXIst International Symposium on Discharges and Electrical Insulation in Vacuum, 2004. Proceedings. ISDEIV.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DEIV.2004.1422608","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Current status and developing trends of Cu-Cr contact materials for VCB
This paper briefly reviews the Cu-Cr materials which are widely adopted for contacts in medium-voltage, high current vacuum circuit breakers (VCB). It is shown that microstructure is a strategic link between the processing and properties of the contact materials, and why the quality and performance of Cn-Cr alloy contact materials are superior to that of CuCr p/m contact materials.