{"title":"超薄铜箔覆层板上的裸铜电路","authors":"J. Konicek","doi":"10.1109/EIC.1977.7461929","DOIUrl":null,"url":null,"abstract":"Combined usage of two recent developments — 5 microns (1/8 oz.) copper foil and of hot gas leveling technique for solder application — opens a new, unique way of manufacturing thru-hole plated PC boards with substantial cost savings. These cost savings are realized as a result of elimination of processes and problems created by or connected in some way with solder plating operations. The new, cost saving sacrificial copper technique is extremely simple to adopt and utilize in PC manufacturing and with advantage can be used on a full scale of pattern densities — from ordinary boards to extremely fine line circuits.","PeriodicalId":214025,"journal":{"name":"1977 EIC 13th Electrical/Electronics Insulation Conference","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Bare copper circuits on ultra-thin copper foil clad laminates\",\"authors\":\"J. Konicek\",\"doi\":\"10.1109/EIC.1977.7461929\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Combined usage of two recent developments — 5 microns (1/8 oz.) copper foil and of hot gas leveling technique for solder application — opens a new, unique way of manufacturing thru-hole plated PC boards with substantial cost savings. These cost savings are realized as a result of elimination of processes and problems created by or connected in some way with solder plating operations. The new, cost saving sacrificial copper technique is extremely simple to adopt and utilize in PC manufacturing and with advantage can be used on a full scale of pattern densities — from ordinary boards to extremely fine line circuits.\",\"PeriodicalId\":214025,\"journal\":{\"name\":\"1977 EIC 13th Electrical/Electronics Insulation Conference\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1977-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1977 EIC 13th Electrical/Electronics Insulation Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EIC.1977.7461929\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1977 EIC 13th Electrical/Electronics Insulation Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EIC.1977.7461929","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Bare copper circuits on ultra-thin copper foil clad laminates
Combined usage of two recent developments — 5 microns (1/8 oz.) copper foil and of hot gas leveling technique for solder application — opens a new, unique way of manufacturing thru-hole plated PC boards with substantial cost savings. These cost savings are realized as a result of elimination of processes and problems created by or connected in some way with solder plating operations. The new, cost saving sacrificial copper technique is extremely simple to adopt and utilize in PC manufacturing and with advantage can be used on a full scale of pattern densities — from ordinary boards to extremely fine line circuits.
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