为北美和欧洲的大学提供芯片制造服务

Proceedings of APCCAS'94 - 1994 Asia Pacific Conference on Circuits and Systems Pub Date : 1994-12-05 DOI:10.1109/APCCAS.1994.514607

K. Ueda

{"title":"为北美和欧洲的大学提供芯片制造服务","authors":"K. Ueda","doi":"10.1109/APCCAS.1994.514607","DOIUrl":null,"url":null,"abstract":"This paper reviews the chip fabrication services for universities in North America and European countries. One feature of these services is the adoption of a chip fabrication system (called Multiproject Chip) that makes it possible for users at universities to fabricate chips at an extremely low cost. The key idea of the multiproject chip system is that sharing a chip or a wafer among several projects makes it possible to greatly reduce manufacturing costs. The paper covers MOSIS (USA), CMC (Canada), CMP (France), EIS (Germany) and Eurochip (Europe) services. Those services have clearly been making great contributions to increasing the expertise in LSI design at universities.","PeriodicalId":231368,"journal":{"name":"Proceedings of APCCAS'94 - 1994 Asia Pacific Conference on Circuits and Systems","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Chip fabrication services for universities in North America and Europe\",\"authors\":\"K. Ueda\",\"doi\":\"10.1109/APCCAS.1994.514607\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper reviews the chip fabrication services for universities in North America and European countries. One feature of these services is the adoption of a chip fabrication system (called Multiproject Chip) that makes it possible for users at universities to fabricate chips at an extremely low cost. The key idea of the multiproject chip system is that sharing a chip or a wafer among several projects makes it possible to greatly reduce manufacturing costs. The paper covers MOSIS (USA), CMC (Canada), CMP (France), EIS (Germany) and Eurochip (Europe) services. Those services have clearly been making great contributions to increasing the expertise in LSI design at universities.\",\"PeriodicalId\":231368,\"journal\":{\"name\":\"Proceedings of APCCAS'94 - 1994 Asia Pacific Conference on Circuits and Systems\",\"volume\":\"15 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-12-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of APCCAS'94 - 1994 Asia Pacific Conference on Circuits and Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APCCAS.1994.514607\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of APCCAS'94 - 1994 Asia Pacific Conference on Circuits and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APCCAS.1994.514607","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

本文综述了北美和欧洲国家的大学芯片制造服务。这些服务的一个特点是采用芯片制造系统(称为多项目芯片)，这使得大学用户能够以极低的成本制造芯片。多项目芯片系统的关键思想是在多个项目之间共享芯片或晶圆，从而可以大大降低制造成本。本文涵盖MOSIS(美国)、CMC(加拿大)、CMP(法国)、EIS(德国)和Eurochip(欧洲)服务。这些服务显然对提高大学LSI设计的专业知识做出了巨大贡献。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Chip fabrication services for universities in North America and Europe

This paper reviews the chip fabrication services for universities in North America and European countries. One feature of these services is the adoption of a chip fabrication system (called Multiproject Chip) that makes it possible for users at universities to fabricate chips at an extremely low cost. The key idea of the multiproject chip system is that sharing a chip or a wafer among several projects makes it possible to greatly reduce manufacturing costs. The paper covers MOSIS (USA), CMC (Canada), CMP (France), EIS (Germany) and Eurochip (Europe) services. Those services have clearly been making great contributions to increasing the expertise in LSI design at universities.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings of APCCAS'94 - 1994 Asia Pacific Conference on Circuits and Systems

自引率

0.00%

发文量