多级主存储器的一个实例

M. Ekman, P. Stenström
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引用次数: 18

摘要

目前的趋势表明,每个处理器芯片的存储芯片数量将在七年内至少增加十倍。这将使DRAM的成本、空间和功耗成为一个严重的问题。本研究提出的主要问题是如何通过将传统的平面主存系统转变为多层次的层次结构来降低成本、尺寸和功耗。通过提出和评估一种实现的性能,我们提出了一个多级主内存层次结构,该实现能够积极使用内存压缩,在计算机之间共享内存资源,以及对未使用的内存区域进行动态电源管理。本文介绍了实现这一目标的关键设计策略。我们使用来自Spec 2K套件、SpecJBB和SAP的应用程序的完整运行来评估我们的实现——典型的桌面和服务器应用程序。我们表明,通常需要的整个内存资源中只有30%必须以DRAM速度访问,而其余的可以以慢一个数量级的速度访问。由此产生的性能开销平均仅为1.2%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A case for multi-level main memory
Current trends suggest that the number of memory chips per processor chip will increase at least a factor of ten in seven years. This will make DRAM cost, the space and the power it consumes a serious problem. The main question raised in this research is how cost, size, and power consumption can be reduced by transforming traditional flat main-memory systems into a multi-level hierarchy. We make the case for a multi-level main memory hierarchy by proposing and evaluating the performance of an implementation that enables aggressive use of memory compression, sharing of memory resources among computers, and dynamic power management of unused regions of memory. This paper presents the key design strategies to make this happen. We evaluate our implementation using complete runs of applications from the Spec 2K suite, SpecJBB, and SAP --- typical desktop and server applications. We show that only 30% of the entire memory resources typically needed must be accessed at DRAM speed whereas the rest can be accessed at a speed that is a magnitude slower. The resulting performance overhead is shown to be only 1.2% on average.
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