固态微波模块中连接器的焊接密封。问题与解决方案

Electronic engineering Series 2 Semiconductor devices Pub Date : 1900-01-01 DOI:10.36845/2073-8250-2020-259-4-37-42

A. S. Sonevitskiy, V. Zhukov

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引用次数: 0

摘要

本文介绍了一种有前途的技术，利用锡铅焊料密封现代固态微波模块的电流传输元件:连接器，引线和其他。这项技术是在S&PE脉冲星JSC开发和实施的。文章强调了该技术的优点和缺点，并给出了所用结构的示意图。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

SOLDER SEALING of CONNECTORS IN SOLID-STATE MICROWAVE MODULES. PROBLEMS AND SOLUTIONS

This article presents the study of a promising technology utilizing the tin-lead solder for the sealing of current-transmitting components of modern solid-state microwave modules: connectors, leads and others. This technology was developed and implemented at the S&PE Pulsar JSC. The article highlights the advantages and disadvantages of the technique, presents the diagrams of the structures used.

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Electronic engineering Series 2 Semiconductor devices

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