波长至2.3 μm的高速GalnAsSb/GaSb PIN光电探测器

J. Bowers, A. Srivastava, C. Burrus, M. DeWinter, M. Pollack, J. Zyskind
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引用次数: 37

摘要

未来的通信系统需要使用新型中红外光纤材料,在2-4 μm波长范围内具有极低的预测损耗。我们报告了在室温下以高速和高量子效率工作的前置照明GalnAsSb/GaSb PIN同质结光电二极管1的性能改进。光电二极管在3 μm厚的n型Ga0.82ln0.18As0.17Sb0.83表面下0.3 μm处形成zn扩散均匀结。该层在GaSb衬底上通过液相外延生长,并掺杂Sn至n = 2.5 × 1015cm−3的水平。100 μm直径的台面表面的部分金属化允许芯片的正面照明,其封装如参考文献2所述。在2.2 μm波长范围内,无增透涂层的外量子效率恒定在55 ~ 65%。在1.06 μm时,探测器的脉冲响应为110 ps,在1.3 μm时,它以高达4 Gbit/s的比特率响应伪随机调制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High-speed GalnAsSb/GaSb PIN photodetectors for wavelengths to 2.3 μm
Photodetectors are needed for future communications systems utilizing novel mid-infrared fiber materials with extremely low predicted losses in the 2–4-μm wavelength range. We report improved performance of front-illuminated GalnAsSb/GaSb PIN homojunction photodiodes1 that operate with high speed and high quantum efficiency at room temperature. The photodiodes consist of a Zn-diffused homojunction 0.3 μm below the surface of a 3-μm thick layer of n-type Ga0.82ln0.18As0.17Sb0.83. This layer was grown by liquid-phase epitaxy on a GaSb substrate and doped with Sn to a level of n = 2.5 × 1015cm−3. A partial metallization of the 100-μm diam mesa surface allows for front illumination of the chips, which are packaged as described in Ref. 2. The external quantum efficiency without antireflection coating is constant at 55–65% for wavelengths up to 2.2 μm. At 1.06 μm the impulse response of the detector has a FWHM of 110 ps. At 1.3 μm it responds to pseudorandom modulation at bit rates up to 4 Gbit/s.
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