{"title":"金属源/漏极基电荷捕获存储电池","authors":"Yu-Hsuan Chen, C. Shih, Hung-Jin Teng, C. Lien","doi":"10.23919/SNW.2019.8782895","DOIUrl":null,"url":null,"abstract":"Schottky barrier source/drain produces particular ambipolar conduction and strong hotcarrier generation in CMOS devices. This work presents a new metallic source/drain Ge-based charge-trapping cells for memory applications. Two-dimensional simulations were employed to elucidate the source-side injection programming of Ge-based memory cells and discuss the differences of cell characteristics between the Ge and Si cells.","PeriodicalId":170513,"journal":{"name":"2019 Silicon Nanoelectronics Workshop (SNW)","volume":"70 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Metallic Source/Drain Ge-Based Charge-Trapping Memory Cells\",\"authors\":\"Yu-Hsuan Chen, C. Shih, Hung-Jin Teng, C. Lien\",\"doi\":\"10.23919/SNW.2019.8782895\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Schottky barrier source/drain produces particular ambipolar conduction and strong hotcarrier generation in CMOS devices. This work presents a new metallic source/drain Ge-based charge-trapping cells for memory applications. Two-dimensional simulations were employed to elucidate the source-side injection programming of Ge-based memory cells and discuss the differences of cell characteristics between the Ge and Si cells.\",\"PeriodicalId\":170513,\"journal\":{\"name\":\"2019 Silicon Nanoelectronics Workshop (SNW)\",\"volume\":\"70 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 Silicon Nanoelectronics Workshop (SNW)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/SNW.2019.8782895\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 Silicon Nanoelectronics Workshop (SNW)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/SNW.2019.8782895","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Schottky barrier source/drain produces particular ambipolar conduction and strong hotcarrier generation in CMOS devices. This work presents a new metallic source/drain Ge-based charge-trapping cells for memory applications. Two-dimensional simulations were employed to elucidate the source-side injection programming of Ge-based memory cells and discuss the differences of cell characteristics between the Ge and Si cells.