射频连接器与微带线焊接区的阻抗补偿

2018 10th International Conference on Communications, Circuits and Systems (ICCCAS) Pub Date : 2018-12-01 DOI:10.1109/ICCCAS.2018.8768967

Ziren Wang, Jinchun Gao, H. M. Bilal, Jiahao Luo, Xiaoming Li

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引用次数: 7

摘要

射频电路中信号的传输损耗问题越来越受到人们的关注。本文主要研究了由焊点引起的阻抗不连续损失，并提出了两种补偿方案。然后，在三维电磁场仿真软件中建立SMP射频连接器和微带线模型，比较补偿前后的S参数和时域反射(TDR)。最后，测量了补偿前后SMP射频连接器和微带线的S参数。仿真和测量结果表明，补偿后的射频连接器和微带线的信号完整性和传输性能得到了显著改善。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Impedance Compensation of the Welding Area of the RF Connector and Microstrip Line

The transmission loss of the signal in the radio frequency circuit has gained much more attention. In this paper, the loss of the impedance discontinuity caused by the solder joint was mainly investigated and two compensation schemes were proposed. Then, the SMP RF connector and microstrip line models were established in 3D electromagnetic field simulation software, and the S parameters and time domain reflectometry (TDR) before and after compensation were compared. Finally, the S parameters of SMP RF connector and microstrip line before and after the compensation were measured. Both the simulation and the measurement show that the signal integrity and transmission performance of compensated RF connector and microstrip line has been significantly improved.

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2018 10th International Conference on Communications, Circuits and Systems (ICCCAS)

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