确保硬件网络安全的人工智能太赫兹测试技术

2020 IEEE Research and Applications of Photonics in Defense Conference (RAPID) Pub Date : 2020-08-01 DOI:10.1109/RAPID49481.2020.9195662

Naznin Akter, M. Karabiyik, Anthony Wright, M. Shur, N. Pala

{"title":"确保硬件网络安全的人工智能太赫兹测试技术","authors":"Naznin Akter, M. Karabiyik, Anthony Wright, M. Shur, N. Pala","doi":"10.1109/RAPID49481.2020.9195662","DOIUrl":null,"url":null,"abstract":"We report on a novel non-destructive testing method for integrated circuits (ICs) by measuring their response to scanning terahertz and sub-terahertz radiation at the pins. Analyzing the response using artificial intelligence (AI), counterfeit, altered, or damaged ICs can be identified as in-package and in-situ.","PeriodicalId":220244,"journal":{"name":"2020 IEEE Research and Applications of Photonics in Defense Conference (RAPID)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"AI Powered THz Testing Technology for Ensuring Hardware Cybersecurity\",\"authors\":\"Naznin Akter, M. Karabiyik, Anthony Wright, M. Shur, N. Pala\",\"doi\":\"10.1109/RAPID49481.2020.9195662\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We report on a novel non-destructive testing method for integrated circuits (ICs) by measuring their response to scanning terahertz and sub-terahertz radiation at the pins. Analyzing the response using artificial intelligence (AI), counterfeit, altered, or damaged ICs can be identified as in-package and in-situ.\",\"PeriodicalId\":220244,\"journal\":{\"name\":\"2020 IEEE Research and Applications of Photonics in Defense Conference (RAPID)\",\"volume\":\"14 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE Research and Applications of Photonics in Defense Conference (RAPID)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RAPID49481.2020.9195662\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE Research and Applications of Photonics in Defense Conference (RAPID)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RAPID49481.2020.9195662","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 6

摘要

我们报告了一种新的集成电路无损检测方法，通过测量其在引脚处对扫描太赫兹和次太赫兹辐射的响应。使用人工智能(AI)分析响应，可以将伪造，更改或损坏的ic识别为封装内和原位。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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AI Powered THz Testing Technology for Ensuring Hardware Cybersecurity

We report on a novel non-destructive testing method for integrated circuits (ICs) by measuring their response to scanning terahertz and sub-terahertz radiation at the pins. Analyzing the response using artificial intelligence (AI), counterfeit, altered, or damaged ICs can be identified as in-package and in-situ.

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来源期刊

2020 IEEE Research and Applications of Photonics in Defense Conference (RAPID)

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