GaN-on-Si E-mode MOSc-HEMT中pBTI降解的新见解

W. Vandendaele, X. Garros, Thomas Lorin, E. Morvan, A. Torres, R. Escoffier, M. Jaud, M. Plissonnier, F. Gaillard
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引用次数: 7

摘要

超快交流pBTI测量首次应用于Si e模MOSc-HEMT上的GaN,并与直流pBTI进行了比较。全凹槽Al2O3/GaN MOS栅极可用于各种频率、占空比和应力次数的交流信号。然后通过RC模型与CET图相结合来模拟退化和松弛特性,并拟合到实验数据中。这张图揭示了两个陷阱种群的存在,也通过ΔVth降解动力学观察到。在交流条件下估计加速因子(栅极电压和温度)以及TTF(故障时间),并且与直流应力条件相比显示出更长的寿命。最后对动态变异性进行了研究,表明我们的装置服从正态分布。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A novel insight of pBTI degradation in GaN-on-Si E-mode MOSc-HEMT
For the first time, ultrafast AC pBTI measurements are applied to GaN on Si E-mode MOSc-HEMT and compared to DC pBTI. Full recess Al2O3/GaN MOS gate is submitted to AC signals with various frequencies, duty factors and stress times. The degradation and relaxation characteristics are then modeled through a RC model combined to a CET map and fitted to experimental data. This map reveals the presence of two trap populations, also observed through ΔVth degradation kinetics. Acceleration factors (gate voltage and temperature) are estimated as well as TTF (Time to Failure) under AC conditions and show an extended lifetime compared to DC stress conditions. Finally dynamic variability is studied and indicates that our devices are ruled by normal distributions.
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