K. Kiranmai, R. V. Damodaran, M. Alshanqiti, Lin Tayara, Shahad Mohamed Obaid Alsereidi, Alyazia Aldhaheri, H. Shareef
{"title":"共地电压源型逆变器的热分析与比较","authors":"K. Kiranmai, R. V. Damodaran, M. Alshanqiti, Lin Tayara, Shahad Mohamed Obaid Alsereidi, Alyazia Aldhaheri, H. Shareef","doi":"10.1109/ICECTA57148.2022.9990086","DOIUrl":null,"url":null,"abstract":"Non-isolated inverters have gained popularity in low-power renewable applications. Among these, the common-ground inverter has the advantage of eliminating leakage currents and common-mode voltages by bypassing the parasitic capacitance. Many of the common-ground topologies have a higher number of switching and passive components in comparison to the commonly used H-bridge voltage source inverter (HB-VSI). Nevertheless, there exists a few common-ground voltage source inverters (CG-VSIs) that have a similar number of components. However, it is necessary to analyze the power losses and thermal behavior of the CG-VSI and compare the chances of failure in comparison to the conventional HB-VSI. This paper presents the switch stress, power loss, and thermal analysis of the switching devices in a CG-VSI that has the same number of components and a similar configuration as the HB-VSI. The simulations are performed on the PLECS software for different loads and switching frequencies. The results indicate that each of the switches of the CG-VSI has different stresses, power losses, and thermal characteristics. Furthermore, the thermal behavior of switches in the considered CG-VSI can be comparable if the switches are chosen appropriately.","PeriodicalId":337798,"journal":{"name":"2022 International Conference on Electrical and Computing Technologies and Applications (ICECTA)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-11-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal Analysis and Comparison of Common-Ground Voltage Source Inverter\",\"authors\":\"K. Kiranmai, R. V. Damodaran, M. Alshanqiti, Lin Tayara, Shahad Mohamed Obaid Alsereidi, Alyazia Aldhaheri, H. Shareef\",\"doi\":\"10.1109/ICECTA57148.2022.9990086\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Non-isolated inverters have gained popularity in low-power renewable applications. Among these, the common-ground inverter has the advantage of eliminating leakage currents and common-mode voltages by bypassing the parasitic capacitance. Many of the common-ground topologies have a higher number of switching and passive components in comparison to the commonly used H-bridge voltage source inverter (HB-VSI). Nevertheless, there exists a few common-ground voltage source inverters (CG-VSIs) that have a similar number of components. However, it is necessary to analyze the power losses and thermal behavior of the CG-VSI and compare the chances of failure in comparison to the conventional HB-VSI. This paper presents the switch stress, power loss, and thermal analysis of the switching devices in a CG-VSI that has the same number of components and a similar configuration as the HB-VSI. The simulations are performed on the PLECS software for different loads and switching frequencies. The results indicate that each of the switches of the CG-VSI has different stresses, power losses, and thermal characteristics. Furthermore, the thermal behavior of switches in the considered CG-VSI can be comparable if the switches are chosen appropriately.\",\"PeriodicalId\":337798,\"journal\":{\"name\":\"2022 International Conference on Electrical and Computing Technologies and Applications (ICECTA)\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-11-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 International Conference on Electrical and Computing Technologies and Applications (ICECTA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICECTA57148.2022.9990086\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electrical and Computing Technologies and Applications (ICECTA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICECTA57148.2022.9990086","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal Analysis and Comparison of Common-Ground Voltage Source Inverter
Non-isolated inverters have gained popularity in low-power renewable applications. Among these, the common-ground inverter has the advantage of eliminating leakage currents and common-mode voltages by bypassing the parasitic capacitance. Many of the common-ground topologies have a higher number of switching and passive components in comparison to the commonly used H-bridge voltage source inverter (HB-VSI). Nevertheless, there exists a few common-ground voltage source inverters (CG-VSIs) that have a similar number of components. However, it is necessary to analyze the power losses and thermal behavior of the CG-VSI and compare the chances of failure in comparison to the conventional HB-VSI. This paper presents the switch stress, power loss, and thermal analysis of the switching devices in a CG-VSI that has the same number of components and a similar configuration as the HB-VSI. The simulations are performed on the PLECS software for different loads and switching frequencies. The results indicate that each of the switches of the CG-VSI has different stresses, power losses, and thermal characteristics. Furthermore, the thermal behavior of switches in the considered CG-VSI can be comparable if the switches are chosen appropriately.