J. Shibata, M. Horita, N. Izumi, T. Shikano, M. Okada, Y. Noguchi, K. Imamura, H. Fukunaga, M. Yasunaga, T. Hirai, T. Hashimoto, Y. Takemoto
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A fine pitch ball grid array (FBGA) has been developed which is suitable mainly for logic devices such as micro control units (MCU) and application specific integrated circuits (ASIC) for consumer portable electronic instruments. The FBGA has a construction in which a die is attached to a glass-epoxy interposer with a single layer conductor. Wire bonding and transfer molding are applied in the same manner as lead frame type packages. The FBGA has a smaller body and higher performance than conventional packages. The package structure, assembly process, performance and reliability test results are introduced.
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