C. O'Sullivan, Chris Campbell, Maeve Colbert, Darren Collins, Patrick Kelleher, Krzystof Niewiadomski, F. Pini, Jan Pleskac, Tim O'Connor, Jerry O'Mahony, Paddy O'Reilly, K. O'Sullivan
{"title":"基于0.18μm CMOS的高集成度移动卫星业务用户终端收发器,包含用于卫星切换的双接收器和用于PA线性化的数字预失真","authors":"C. O'Sullivan, Chris Campbell, Maeve Colbert, Darren Collins, Patrick Kelleher, Krzystof Niewiadomski, F. Pini, Jan Pleskac, Tim O'Connor, Jerry O'Mahony, Paddy O'Reilly, K. O'Sullivan","doi":"10.23919/EUMIC.2018.8539873","DOIUrl":null,"url":null,"abstract":"This paper describes the first single chip transceiver for Mobile Satellite Services that does not require external mixers, LNA or IF filter. The IC supports LEO satellite constellations including those using small satellites in L band up to 240k symbols per second (ksps). The RFIC allows data connectivity globally in new applications and enables remote devices and sensors to be connected to the Internet of Things. The chip integrates TX and dual RX paths from digital to RF and includes a DPD algorithm for PA linearization with a feedback path.","PeriodicalId":248339,"journal":{"name":"2018 13th European Microwave Integrated Circuits Conference (EuMIC)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Highly Integrated Transceiver for Mobile Satellite Services User Terminals Incorporating Dual Receivers for Satellite Handover and Digital Pre-Distortion for PA Linearization on 0.18μm CMOS\",\"authors\":\"C. O'Sullivan, Chris Campbell, Maeve Colbert, Darren Collins, Patrick Kelleher, Krzystof Niewiadomski, F. Pini, Jan Pleskac, Tim O'Connor, Jerry O'Mahony, Paddy O'Reilly, K. O'Sullivan\",\"doi\":\"10.23919/EUMIC.2018.8539873\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes the first single chip transceiver for Mobile Satellite Services that does not require external mixers, LNA or IF filter. The IC supports LEO satellite constellations including those using small satellites in L band up to 240k symbols per second (ksps). The RFIC allows data connectivity globally in new applications and enables remote devices and sensors to be connected to the Internet of Things. The chip integrates TX and dual RX paths from digital to RF and includes a DPD algorithm for PA linearization with a feedback path.\",\"PeriodicalId\":248339,\"journal\":{\"name\":\"2018 13th European Microwave Integrated Circuits Conference (EuMIC)\",\"volume\":\"23 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 13th European Microwave Integrated Circuits Conference (EuMIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/EUMIC.2018.8539873\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 13th European Microwave Integrated Circuits Conference (EuMIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/EUMIC.2018.8539873","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Highly Integrated Transceiver for Mobile Satellite Services User Terminals Incorporating Dual Receivers for Satellite Handover and Digital Pre-Distortion for PA Linearization on 0.18μm CMOS
This paper describes the first single chip transceiver for Mobile Satellite Services that does not require external mixers, LNA or IF filter. The IC supports LEO satellite constellations including those using small satellites in L band up to 240k symbols per second (ksps). The RFIC allows data connectivity globally in new applications and enables remote devices and sensors to be connected to the Internet of Things. The chip integrates TX and dual RX paths from digital to RF and includes a DPD algorithm for PA linearization with a feedback path.