基于Cu微量循环弯曲平均截面应变的疲劳模型

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI:10.1109/ESIME.2011.5765858

D. Farley, A. Dasgupta, Y. Zhou, J. Caers, J. D. de Vries

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引用次数: 3

摘要

本文研究了印刷布线组件(pwa)上铜迹的准静态机械循环耐久性。在铜衬垫上填充陆地网格阵列(LGA)组件的PWA试样在零到最大值的三点弯曲下循环失效。失效的定义是由于疲劳损伤在整个轨迹的横截面上传播而产生的电开口。收集失效统计数据并进行失效分析，以识别靠近焊盘连接处的铜道的疲劳失效。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Fatigue model based on average cross-section strain of Cu trace cyclic bending

This study focuses on quasi-static mechanical cycling durability of copper traces on printed wiring assemblies (PWAs). PWA specimens populated with Land Grid Array (LGA) components on copper-defined pads were cycled to failure under zero-to-max, three-point bending. Failure is defined in terms of electrical opens due to fatigue damage propagation through the entire cross-section of the trace. Failure statistics were collected and failure analysis was conducted to identify fatigue failures in the copper traces, near the connection to the solder pad.

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来源期刊

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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