{"title":"微器件中流体阻尼效应的宏观建模","authors":"G. Wachutka, G. Schrag, R. Sattler","doi":"10.1109/ASDAM.2002.1088536","DOIUrl":null,"url":null,"abstract":"The operation of many mechatronical microdevices is significantly affected by viscous fluid damping effects. We present a methodology how these effects can be properly included in physically based microdevice and full system models for the effort-economizing and yet accurate predictive simulation of the operation of micro-mechatronical systems. The usability and quality of the approach is demonstrated by computational results for highly perforated microdevices.","PeriodicalId":179900,"journal":{"name":"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem","volume":"59 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Macromodeling of fluidic damping effects in microdevices\",\"authors\":\"G. Wachutka, G. Schrag, R. Sattler\",\"doi\":\"10.1109/ASDAM.2002.1088536\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The operation of many mechatronical microdevices is significantly affected by viscous fluid damping effects. We present a methodology how these effects can be properly included in physically based microdevice and full system models for the effort-economizing and yet accurate predictive simulation of the operation of micro-mechatronical systems. The usability and quality of the approach is demonstrated by computational results for highly perforated microdevices.\",\"PeriodicalId\":179900,\"journal\":{\"name\":\"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem\",\"volume\":\"59 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-12-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASDAM.2002.1088536\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASDAM.2002.1088536","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Macromodeling of fluidic damping effects in microdevices
The operation of many mechatronical microdevices is significantly affected by viscous fluid damping effects. We present a methodology how these effects can be properly included in physically based microdevice and full system models for the effort-economizing and yet accurate predictive simulation of the operation of micro-mechatronical systems. The usability and quality of the approach is demonstrated by computational results for highly perforated microdevices.