{"title":"从锥形微带到波纹微带的宽带过渡","authors":"Anil Kumar Nayak, Vinit Singh Yadav, A. Patnaik","doi":"10.1109/IMaRC45935.2019.9118708","DOIUrl":null,"url":null,"abstract":"In this paper, a wideband transition from tapered microstrip (TMS) to corrugated substrate integrated waveguide (CSIW) for Ku band application is presented. The design was initiated from a tapered microstrip to substrate integrated waveguide (SIW) transition and stubs are used at the feeding to improve impedance matching. Additionally, the CSIW implemented in the transition is meant for further size reduction, improved bandwidth, and reduced insertion loss. The measured fractional impedance bandwidth of 50 % (12-18 GHz) below -15 dB (simulated: -18 dB) has been achieved of the proposed transition. An insertion loss below 3 dB is obtained. The measured results are in agreement with the simulation results.","PeriodicalId":338001,"journal":{"name":"2019 IEEE MTT-S International Microwave and RF Conference (IMARC)","volume":"103 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Wideband Transition from Tapered Microstrip to Corrugated SIW\",\"authors\":\"Anil Kumar Nayak, Vinit Singh Yadav, A. Patnaik\",\"doi\":\"10.1109/IMaRC45935.2019.9118708\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a wideband transition from tapered microstrip (TMS) to corrugated substrate integrated waveguide (CSIW) for Ku band application is presented. The design was initiated from a tapered microstrip to substrate integrated waveguide (SIW) transition and stubs are used at the feeding to improve impedance matching. Additionally, the CSIW implemented in the transition is meant for further size reduction, improved bandwidth, and reduced insertion loss. The measured fractional impedance bandwidth of 50 % (12-18 GHz) below -15 dB (simulated: -18 dB) has been achieved of the proposed transition. An insertion loss below 3 dB is obtained. The measured results are in agreement with the simulation results.\",\"PeriodicalId\":338001,\"journal\":{\"name\":\"2019 IEEE MTT-S International Microwave and RF Conference (IMARC)\",\"volume\":\"103 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE MTT-S International Microwave and RF Conference (IMARC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMaRC45935.2019.9118708\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE MTT-S International Microwave and RF Conference (IMARC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMaRC45935.2019.9118708","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Wideband Transition from Tapered Microstrip to Corrugated SIW
In this paper, a wideband transition from tapered microstrip (TMS) to corrugated substrate integrated waveguide (CSIW) for Ku band application is presented. The design was initiated from a tapered microstrip to substrate integrated waveguide (SIW) transition and stubs are used at the feeding to improve impedance matching. Additionally, the CSIW implemented in the transition is meant for further size reduction, improved bandwidth, and reduced insertion loss. The measured fractional impedance bandwidth of 50 % (12-18 GHz) below -15 dB (simulated: -18 dB) has been achieved of the proposed transition. An insertion loss below 3 dB is obtained. The measured results are in agreement with the simulation results.
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