{"title":"基于单片机的石英基微孔电化学放电加工(ECDM)设备","authors":"S. Saranya, Adepu Ravi Sankar","doi":"10.1109/iSES50453.2020.00057","DOIUrl":null,"url":null,"abstract":"Electrochemical discharge machining (ECDM) is a hybrid micromachining technique used for micro-structuring quartz substrates. In the present work, we have built a microcontroller based ECDM setup for drilling quartz substrates. This setup can be effectively used to fabricate precise micro-holes using the constant velocity feed drilling technique. The tool can be moved along the Z-axis with the minimum and maximum speeds of 1 $mm/hr$ and 50 $mm/hr$ respectively. In order to study the effect of tool feed rate (TFR) on precision improvement, micro-holes were fabricated at different tool feed rates ranging from 0.3 $\\mu m/\\sec$ to 1.7 $\\mu m/sec$. The optimum TFR for fabricating micro-holes with the least entrance diameter, central diameter and overcut was observed to be 0.8 $\\mu m/sec$. The lower TFR values $(\\lt 0.8\\mu m/\\sec)$ can be used for fabricating through-holes on the substrates. A through-hole having with an aspect ratio of 2.32 with entrance and exit diameters of 820 $\\mu m$ and 677 $\\mu m$ respectively was fabricated at a TFR of 0.6 $\\mu m/sec$.","PeriodicalId":246188,"journal":{"name":"2020 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A Microcontroller-based Electrochemical Discharge Machining (ECDM) Equipment for Micro-drilling of Quartz Substrates\",\"authors\":\"S. Saranya, Adepu Ravi Sankar\",\"doi\":\"10.1109/iSES50453.2020.00057\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Electrochemical discharge machining (ECDM) is a hybrid micromachining technique used for micro-structuring quartz substrates. In the present work, we have built a microcontroller based ECDM setup for drilling quartz substrates. This setup can be effectively used to fabricate precise micro-holes using the constant velocity feed drilling technique. The tool can be moved along the Z-axis with the minimum and maximum speeds of 1 $mm/hr$ and 50 $mm/hr$ respectively. In order to study the effect of tool feed rate (TFR) on precision improvement, micro-holes were fabricated at different tool feed rates ranging from 0.3 $\\\\mu m/\\\\sec$ to 1.7 $\\\\mu m/sec$. The optimum TFR for fabricating micro-holes with the least entrance diameter, central diameter and overcut was observed to be 0.8 $\\\\mu m/sec$. The lower TFR values $(\\\\lt 0.8\\\\mu m/\\\\sec)$ can be used for fabricating through-holes on the substrates. A through-hole having with an aspect ratio of 2.32 with entrance and exit diameters of 820 $\\\\mu m$ and 677 $\\\\mu m$ respectively was fabricated at a TFR of 0.6 $\\\\mu m/sec$.\",\"PeriodicalId\":246188,\"journal\":{\"name\":\"2020 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS)\",\"volume\":\"32 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/iSES50453.2020.00057\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/iSES50453.2020.00057","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Microcontroller-based Electrochemical Discharge Machining (ECDM) Equipment for Micro-drilling of Quartz Substrates
Electrochemical discharge machining (ECDM) is a hybrid micromachining technique used for micro-structuring quartz substrates. In the present work, we have built a microcontroller based ECDM setup for drilling quartz substrates. This setup can be effectively used to fabricate precise micro-holes using the constant velocity feed drilling technique. The tool can be moved along the Z-axis with the minimum and maximum speeds of 1 $mm/hr$ and 50 $mm/hr$ respectively. In order to study the effect of tool feed rate (TFR) on precision improvement, micro-holes were fabricated at different tool feed rates ranging from 0.3 $\mu m/\sec$ to 1.7 $\mu m/sec$. The optimum TFR for fabricating micro-holes with the least entrance diameter, central diameter and overcut was observed to be 0.8 $\mu m/sec$. The lower TFR values $(\lt 0.8\mu m/\sec)$ can be used for fabricating through-holes on the substrates. A through-hole having with an aspect ratio of 2.32 with entrance and exit diameters of 820 $\mu m$ and 677 $\mu m$ respectively was fabricated at a TFR of 0.6 $\mu m/sec$.