基于商用MEMS工艺的晶圆级真空封装圆盘谐振陀螺仪设计与分析

Balaadithya Uppalapati, M. Ahamed, V. Chodavarapu
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引用次数: 4

摘要

我们提出了一种模式匹配的圆盘谐振陀螺仪的设计和分析,其特点是高质量因子超过100万。采用几何补偿技术设计了模式匹配谐振器,减小了两个简并模之间的频率分裂。陀螺仪传感器采用Teledyne DALSA Semiconductor Incorporated (TDSI)提供的MEMS集成设计惯性传感器(MIDIS)工艺设计。MIDIS工艺在10m Torr下提供超干净的晶圆级真空封装。我们的圆盘谐振陀螺仪具有直径600 μm的圆形,由40 μm厚的单晶硅材料制成。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design and analysis of wafer-level vacuum-encapsulated disk resonator gyroscope using a commercial MEMS process
We present the design and analysis of a mode-matched disk resonator gyroscope that is characterized by a high quality factor exceeding 1 million. The mode match resonator is designed using geometric compensation technique for reducing frequency split between two degenerate modes. The gyroscope sensor is designed using MEMS Integrated Design for Inertial Sensors (MIDIS) process offered by Teledyne DALSA Semiconductor Incorporated (TDSI). The MIDIS process offers ultra clean wafer-level vacuum encapsulation at 10m Torr. Our disk resonator gyroscope has a circular shape with 600 μm diameter and is made with 40 μm thick single crystal silicon material.
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