CMOS衬底供电的石墨烯p-i-n结的高检出率

Tingyi Gu, Dun Mao, Tiantian Li, T. Kananen
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引用次数: 0

摘要

光载流子产生和分离的足够大的耗尽区是二维材料光电器件的关键因素,但很少有器件配置用于石墨烯空间电荷区域的确定性控制,具有令人信服的可扩展性。在这里,我们研究了石墨烯-硅p-i-n光电二极管在铸造加工的平面光子晶体波导结构中定义,实现了可见-近红外,零偏置和超快的光探测。石墨烯与硅的宽本征区电接触,并延伸到p和n掺杂区,作为电子增益的主要光载流子传导通道。石墨烯通过超快的面外界面载流子转移和随后的面内内置电场辅助载流子收集显着提高了器件速度。在零偏置电压下,40 GHz的转换信噪比超过50 dB,并且可以通过石墨烯-i Si界面上的热载流子增益和石墨烯掺杂Si界面上的雪崩过程进一步放大量子效率。通过对混合器件在一组不同载波注入速率下的宽带相干射频响应拟合小信号模型,对混合结构上的多结结构进行了参数化。通过设计器件尺寸,可以抑制电阻-电容延迟小于1皮秒,并实现亚太赫兹带宽操作。由于器件结构完全由纳米衬底定义,本研究首次展示了免加工后的二维材料有源硅光子器件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High Detectivity in CMOS Substrate Powered Graphene p-i-n Junction
Sufficiently large depletion region for photocarrier generation and separation is a key factor for two-dimensional material optoelectronic devices, but few device configurations have been explored for a deterministic control of a space charge region area in graphene with convincing scalability. Here we investigate a graphene-silicon p-i-n photodiode defined in a foundry processed planar photonic crystal waveguide structure, achieving visible — near-infrared, zero-bias and ultrafast photodetection. Graphene is electrically contacting to the wide intrinsic region of silicon and extended to the p an n doped region, functioning as the primary photocarrier conducting channel for electronic gain. Graphene significantly improves the device speed through ultrafast out-of-plane interfacial carrier transfer and the following in-plane built-in electric field assisted carrier collection. More than 50 dB converted signal-to-noise ratio at 40 GHz has been demonstrated under zero bias voltage, with quantum efficiency could be further amplified by hot carrier gain on graphene-i Si interface and avalanche process on graphene-doped Si interface. The multi-junction structure on the hybrid structure is parameterized by fitting a small-signal model to the broadband coherent radio-frequency response of the hybrid device at a set of different carrier injection rates. By engineering the device dimensions, it is possible to suppress the resistance-capacitance delay being less than a picosecond and enable sub-Terahertz bandwidth operation. With the device architecture fully defined by nanomanufactured substrate, this study is the first demonstration of post-fabrication-free two-dimensional material active silicon photonic devices.
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