半导体封装，下一波浪潮

2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2015-03-02 DOI:10.1109/MEMSYS.2015.7050930

C. Hung

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引用次数: 1

摘要

随着智能手机和可穿戴设备的小型化，未来MEMS传感器的增长是不可避免的趋势。在本次演讲中，将展示和讨论3D IC封装解决方案的下一波架构与传统封装技术的对比，包括MEMS应用。

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Semiconductor ic packaging, the next wave

MEMS sensor growth in the future is expected with inevitable trend on miniaturization for smartphone and wearable devices. In this presentation, the next wave architecture of 3D IC packaging solution overview versus traditional packaging technologies will be demonstrated and discussed, for applications including MEMS.

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来源期刊

2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

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