低温(<600/spl℃)下LPCVD和SPC制备NMOS和CMOS TFT逆变器的比较

G. Gautier, C. E. Viana, S. Crand, R. Rogel, N. Morimoto, O. Bonnaud
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引用次数: 1

摘要

在对LPCVD(低压化学气相沉积)和SPC(固相结晶)技术在低温下制备的n型多晶硅薄膜晶体管(NMOS-TFT)的电性能改进进行了多次实验研究之后,有必要实现一种互补的TFT电池技术(类cmos TFT)的设计工艺。这个基本单元对于设计高效的数字电路非常有用。本文介绍了两种逆变器的开发过程,并对其进行了比较:基于两个nmos -TFT的nmos -逆变器和一个类似cmos的TFT逆变器。这项工作可以验证该过程,并量化电气特性的改进,如噪声裕度、增益和输出电压幅度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comparison of NMOS and CMOS TFT inverters fabricated by LPCVD and SPC techniques at low temperature (<600/spl deg/C)
After several experimental studies on improvement of the electrical performances of N-type polysilicon thin-film transistors (NMOS-TFT) fabricated by LPCVD (Low Pressure Chemical Vapor Deposition) and SPC (Solid Phase Crystallization) techniques at low temperature, it was necessary to implement a process to design a complementary TFT cell technology (CMOS-like TFT). This elementary cell is useful indeed essential to design efficient digital circuits. This paper describes the process developed and presents a comparison between two inverters: NMOS-inverter based on the use of two NMOS-TFTs and a CMOS-like TFT inverter. This work has allowed to validate the process and to quantify the improvement of the electrical characteristics such as noise margins, gain and output voltage amplitude.
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