电子设备材料与制造展望*

{"title":"电子设备材料与制造展望*","authors":"D. D. München, P. Dias, H. Veit","doi":"10.1002/9783527816392.ch5","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":131027,"journal":{"name":"Electronic Waste","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-11-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Materials Used in Electronic Equipment and Manufacturing Perspectives*\",\"authors\":\"D. D. München, P. Dias, H. Veit\",\"doi\":\"10.1002/9783527816392.ch5\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":131027,\"journal\":{\"name\":\"Electronic Waste\",\"volume\":\"41 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-11-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electronic Waste\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1002/9783527816392.ch5\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electronic Waste","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1002/9783527816392.ch5","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}