y波段行波管二次谐波放大器高频结构的UV-LIGA微加工

2015 IEEE International Vacuum Electronics Conference (IVEC) Pub Date : 2015-04-27 DOI:10.1109/IVEC.2015.7223881

Hanyan Li, Jun Cai, Yinghua Du, Xinghui Li, Jinjun Feng

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引用次数: 6

摘要

本文采用UV LIGA技术制备了y波段(170-220GHz)行波管二次谐波放大器的铜高频结构。这两部分在放大器中被粘合和组装。测量结果表明，该放大器在1%占空比下，以11.4GHz的大部分带宽实现了100mW以上的谐波输出功率，最大谐波输出功率达到500mW。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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UV-LIGA microfabrication for high frequency structures of a Y-band TWT 2nd harmonic amplifier

In this paper, we fabricate copper high frequency structures for a Y-band(170-220GHz) TWT 2nd harmonic amplifier using UV LIGA technology. The two halves have been bonded and assembled in the amplifier. The measurement results of the amplifier show that over 100mW harmonic output power with most of the 11.4GHz of bandwidth at 1% duty cycle have been achieved, and the maximum harmonic output power reaches 500mW.

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2015 IEEE International Vacuum Electronics Conference (IVEC)

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