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功率半导体器件的现状与趋势

Proceedings of IECON '93 - 19th Annual Conference of IEEE Industrial Electronics Pub Date : 1993-11-15 DOI:10.1109/IECON.1993.339117
D. Blackburn
{"title":"功率半导体器件的现状与趋势","authors":"D. Blackburn","doi":"10.1109/IECON.1993.339117","DOIUrl":null,"url":null,"abstract":"A brief description of some developments that affect the application of power semiconductor devices is given. Developments in 'chips', packages, simulation, and new materials are included.<<ETX>>","PeriodicalId":132101,"journal":{"name":"Proceedings of IECON '93 - 19th Annual Conference of IEEE Industrial Electronics","volume":"57 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Status and trends in power semiconductor devices\",\"authors\":\"D. Blackburn\",\"doi\":\"10.1109/IECON.1993.339117\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A brief description of some developments that affect the application of power semiconductor devices is given. Developments in 'chips', packages, simulation, and new materials are included.<<ETX>>\",\"PeriodicalId\":132101,\"journal\":{\"name\":\"Proceedings of IECON '93 - 19th Annual Conference of IEEE Industrial Electronics\",\"volume\":\"57 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-11-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IECON '93 - 19th Annual Conference of IEEE Industrial Electronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IECON.1993.339117\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IECON '93 - 19th Annual Conference of IEEE Industrial Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IECON.1993.339117","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

简要介绍了影响功率半导体器件应用的一些发展。包括“芯片”、封装、仿真和新材料的发展
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Status and trends in power semiconductor devices
A brief description of some developments that affect the application of power semiconductor devices is given. Developments in 'chips', packages, simulation, and new materials are included.<>
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Proceedings of IECON '93 - 19th Annual Conference of IEEE Industrial Electronics
Proceedings of IECON '93 - 19th Annual Conference of IEEE Industrial Electronics
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