GaAs mesfet的宽带电磁辐射损伤

J. McAdoo, W. M. Bollen, W. Catoe, R. Kaul
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引用次数: 3

摘要

研究了SiN/sub 2/钝化金属半导体场效应晶体管(MESFET)器件在快速上升时间直流视频脉冲下的失效机制。脉冲强度约为引起单脉冲失效所需值的33%。失效机制是由于表面闪络和钝化层的侵蚀导致性能下降,最终导致栅源金属化溅射。结果是通过使用光学、电子和x射线显微照片以及MESFET终端参数的组合来观察的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Broad-band electromagnetic radiation damage in GaAs MESFETs
A failure mechanism was observed for SiN/sub 2/-passivated metal-semiconductor field-effect-transistor (MESFET) devices exposed to fast-risetime DC video pulses. The intensity of the pulses was about 33% of the value required to cause single-pulse failure. The failure mechanism, which degrades performance by surface flashover and erosion of the passivation layer, eventually leads to sputtering of the gate-source metallization. The results were observed by using a combination of optical, electron, and X-ray micrographs, plus MESFET terminal parameters.<>
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