功能系统TLM模型与功率/热求解器的联合仿真

Tayeb Bouhadiba, M. Moy, F. Maraninchi, J. Cornet, L. Maillet-Contoz, Ilija Materic
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引用次数: 17

摘要

现代的片上系统需要复杂的电源管理策略来控制其功耗和温度。这些电源管理策略通常在软件中部分实现,并提供硬件支持。它们需要尽早进行验证,因此需要开发系统级的功率和温度感知模拟技术。现有的系统级功率和热分析方法通常要么完全抽象功能(只允许简单的场景进行模拟),要么独立于非功能模拟运行功能模拟。本文提出的方法允许对SystemC/TLM模型进行耦合仿真,可能包括实际的嵌入式软件,使用功率和温度求解器(如ATMI或商业工具ACEplorer)。功率和温度分析是根据SystemC/TLM平台发送的刺激完成的,而SystemC/TLM平台又可以根据非功能模拟做出决策。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Co-simulation of Functional SystemC TLM Models with Power/Thermal Solvers
Modern systems-on-chips need sophisticated power-Management policies to control their power consumption and temperature. These power-management policies are usually implemented partly in software, with hardware support. They need to be validated early, hence power and temperature-aware simulation techniques at the system-level need to be developed. Existing approaches for system-level power and thermal analysis usually either completely abstract the functionality (allowing only simple scenarios to be simulated), or run the functional simulation independently from the non-functional one. The approach presented in this paper allows a coupled simulation of a SystemC/TLM model, possibly including the actual embedded software, with a power and temperature solver such as ATMI or the commercial tool ACEplorer. Power and temperature analysis is done based on the stimuli sent by the SystemC/TLM platform, which in turn can take decisions based on the non-functional simulation.
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