{"title":"集成光互连电路板-技术，建模和应用实例","authors":"E. Strake, D. Krabe","doi":"10.1109/LEOSST.2000.869688","DOIUrl":null,"url":null,"abstract":"This contribution presents concepts, technologies, and first results for novel hybrid electrical/optical circuit boards which extend the conventional setup of existing electrical printed circuit boards by incorporating additional layers with optical waveguide structures. A major aspect of the inclusion of optically functional layers into conventional circuit boards is the requirement of maximum compatibility with existing board fabrication and assembly techniques. Any substantial change in board fabrication and assembly parameters has to be avoided in order to obtain the desired cost efficiency.","PeriodicalId":415720,"journal":{"name":"2000 Digest of the LEOS Summer Topical Meetings. Electronic-Enhanced Optics. Optical Sensing in Semiconductor Manufacturing. Electro-Optics in Space. Broadband Optical Networks (Cat. No.00TH8497)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-07-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Circuit boards with integrated optical interconnects-technology, modeling, and application examples\",\"authors\":\"E. Strake, D. Krabe\",\"doi\":\"10.1109/LEOSST.2000.869688\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This contribution presents concepts, technologies, and first results for novel hybrid electrical/optical circuit boards which extend the conventional setup of existing electrical printed circuit boards by incorporating additional layers with optical waveguide structures. A major aspect of the inclusion of optically functional layers into conventional circuit boards is the requirement of maximum compatibility with existing board fabrication and assembly techniques. Any substantial change in board fabrication and assembly parameters has to be avoided in order to obtain the desired cost efficiency.\",\"PeriodicalId\":415720,\"journal\":{\"name\":\"2000 Digest of the LEOS Summer Topical Meetings. Electronic-Enhanced Optics. Optical Sensing in Semiconductor Manufacturing. Electro-Optics in Space. Broadband Optical Networks (Cat. No.00TH8497)\",\"volume\":\"10 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-07-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2000 Digest of the LEOS Summer Topical Meetings. Electronic-Enhanced Optics. Optical Sensing in Semiconductor Manufacturing. Electro-Optics in Space. Broadband Optical Networks (Cat. No.00TH8497)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/LEOSST.2000.869688\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 Digest of the LEOS Summer Topical Meetings. Electronic-Enhanced Optics. Optical Sensing in Semiconductor Manufacturing. Electro-Optics in Space. Broadband Optical Networks (Cat. No.00TH8497)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LEOSST.2000.869688","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Circuit boards with integrated optical interconnects-technology, modeling, and application examples
This contribution presents concepts, technologies, and first results for novel hybrid electrical/optical circuit boards which extend the conventional setup of existing electrical printed circuit boards by incorporating additional layers with optical waveguide structures. A major aspect of the inclusion of optically functional layers into conventional circuit boards is the requirement of maximum compatibility with existing board fabrication and assembly techniques. Any substantial change in board fabrication and assembly parameters has to be avoided in order to obtain the desired cost efficiency.
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