基于可靠性因子共享模型的电子元件寿命评估方法

Linlin Shi, Peiliang Yang, Bin Zhou, Si Chen, Zhenwei Zhou, Danni Hong
{"title":"基于可靠性因子共享模型的电子元件寿命评估方法","authors":"Linlin Shi, Peiliang Yang, Bin Zhou, Si Chen, Zhenwei Zhou, Danni Hong","doi":"10.1145/3579654.3579669","DOIUrl":null,"url":null,"abstract":"An important problem to be solved in reliability simulation of electronic components is to build component-level reliability models based on device-level evaluation results. When the structure or device information and connection composition information of electronic components are obtained, the reliability index information of single point failure can be calculated by device/structure failure model and distribution model. In this paper, a reliability factor sharing model is proposed to evaluate the lifetime of electronic components. For the general case that the components or structures of electronic components are subject to different failure distributions, the non-elementary mapping relationship between device failure distribution and electronic component failure can be established. Furthermore, an efficient and low-complexity method for solving the reliability life of electronic components is constructed by using numerical techniques.","PeriodicalId":146783,"journal":{"name":"Proceedings of the 2022 5th International Conference on Algorithms, Computing and Artificial Intelligence","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Life assessment method of electronic components based on reliability factor sharing model\",\"authors\":\"Linlin Shi, Peiliang Yang, Bin Zhou, Si Chen, Zhenwei Zhou, Danni Hong\",\"doi\":\"10.1145/3579654.3579669\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An important problem to be solved in reliability simulation of electronic components is to build component-level reliability models based on device-level evaluation results. When the structure or device information and connection composition information of electronic components are obtained, the reliability index information of single point failure can be calculated by device/structure failure model and distribution model. In this paper, a reliability factor sharing model is proposed to evaluate the lifetime of electronic components. For the general case that the components or structures of electronic components are subject to different failure distributions, the non-elementary mapping relationship between device failure distribution and electronic component failure can be established. Furthermore, an efficient and low-complexity method for solving the reliability life of electronic components is constructed by using numerical techniques.\",\"PeriodicalId\":146783,\"journal\":{\"name\":\"Proceedings of the 2022 5th International Conference on Algorithms, Computing and Artificial Intelligence\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-12-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 2022 5th International Conference on Algorithms, Computing and Artificial Intelligence\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/3579654.3579669\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2022 5th International Conference on Algorithms, Computing and Artificial Intelligence","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/3579654.3579669","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

在电子元器件可靠性仿真中,基于器件级评估结果建立元器件级可靠性模型是一个需要解决的重要问题。在获得电子元件的结构或器件信息和连接组成信息后,利用器件/结构失效模型和分布模型计算出单点失效的可靠性指标信息。本文提出了一种评估电子元件寿命的可靠性因子共享模型。针对电子元器件元器件或结构存在不同失效分布的一般情况,可以建立器件失效分布与电子元器件失效之间的非初等映射关系。在此基础上,利用数值方法建立了求解电子元件可靠性寿命的高效、低复杂度方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Life assessment method of electronic components based on reliability factor sharing model
An important problem to be solved in reliability simulation of electronic components is to build component-level reliability models based on device-level evaluation results. When the structure or device information and connection composition information of electronic components are obtained, the reliability index information of single point failure can be calculated by device/structure failure model and distribution model. In this paper, a reliability factor sharing model is proposed to evaluate the lifetime of electronic components. For the general case that the components or structures of electronic components are subject to different failure distributions, the non-elementary mapping relationship between device failure distribution and electronic component failure can be established. Furthermore, an efficient and low-complexity method for solving the reliability life of electronic components is constructed by using numerical techniques.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信