复合衬底外延上生长的AlGaN/GaN hemt

V. Hoel, S. Boulay, H. Gérard, V. Rabaland, E. Delos, J. De Jaeger, M. di-Forte-Poisson, C. Brylinski, H. Lahrèche, R. Langer, P. Bove
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引用次数: 3

摘要

本文介绍了在“复合”衬底上生长的MBE和MOCVD外延结构上加工的AlGaN/GaN HEMTs器件的第一个结果。这些衬底基于创新结构,其中薄Si或SiC单晶层被转移到厚多晶SiC晶片的顶部,并具有薄SiO2中间绝缘层。晶体管的制造是基于“TIGER”开发的在SiC块基底上HEMT外延的工艺流程。所获得的结果显示了这种复合器件的能力,提供了类似于目前在大块单晶SiC衬底上获得的HEMT器件的电气和小信号微波性能。复合基板方法对于需要低成本微波功率器件的应用,如移动通信,显得非常有前途。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
AlGaN/GaN HEMTs on epitaxies grown on composite substrate
In this paper, arc presented the first results obtained from AlGaN/GaN HEMTs devices processed on both MBE and MOCVD epitaxial structures grown on "composite" substrates. These substrates are based on innovative structures in which a thin Si or SiC single crystal layer is transferred on top of a thick polycrystalline SiC wafer with a thin SiO2 intermediary insulating layer. The fabrication of the transistors is based on the process flow developed by "TIGER" for HEMT epitaxy on SiC bulk substrates. The obtained results show the capabilities of such composite devices, providing HEMT device electrical and small signal microwave performance similar to those obtained currently on bulk single crystal SiC substrates. The composite substrate approach appears as very promising for applications requiring low cost microwave power devices, such as mobile communications.
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