V. Hoel, S. Boulay, H. Gérard, V. Rabaland, E. Delos, J. De Jaeger, M. di-Forte-Poisson, C. Brylinski, H. Lahrèche, R. Langer, P. Bove
{"title":"复合衬底外延上生长的AlGaN/GaN hemt","authors":"V. Hoel, S. Boulay, H. Gérard, V. Rabaland, E. Delos, J. De Jaeger, M. di-Forte-Poisson, C. Brylinski, H. Lahrèche, R. Langer, P. Bove","doi":"10.1109/EMICC.2007.4412657","DOIUrl":null,"url":null,"abstract":"In this paper, arc presented the first results obtained from AlGaN/GaN HEMTs devices processed on both MBE and MOCVD epitaxial structures grown on \"composite\" substrates. These substrates are based on innovative structures in which a thin Si or SiC single crystal layer is transferred on top of a thick polycrystalline SiC wafer with a thin SiO2 intermediary insulating layer. The fabrication of the transistors is based on the process flow developed by \"TIGER\" for HEMT epitaxy on SiC bulk substrates. The obtained results show the capabilities of such composite devices, providing HEMT device electrical and small signal microwave performance similar to those obtained currently on bulk single crystal SiC substrates. The composite substrate approach appears as very promising for applications requiring low cost microwave power devices, such as mobile communications.","PeriodicalId":436391,"journal":{"name":"2007 European Microwave Integrated Circuit Conference","volume":"152 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-12-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"AlGaN/GaN HEMTs on epitaxies grown on composite substrate\",\"authors\":\"V. Hoel, S. Boulay, H. Gérard, V. Rabaland, E. Delos, J. De Jaeger, M. di-Forte-Poisson, C. Brylinski, H. Lahrèche, R. Langer, P. Bove\",\"doi\":\"10.1109/EMICC.2007.4412657\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, arc presented the first results obtained from AlGaN/GaN HEMTs devices processed on both MBE and MOCVD epitaxial structures grown on \\\"composite\\\" substrates. These substrates are based on innovative structures in which a thin Si or SiC single crystal layer is transferred on top of a thick polycrystalline SiC wafer with a thin SiO2 intermediary insulating layer. The fabrication of the transistors is based on the process flow developed by \\\"TIGER\\\" for HEMT epitaxy on SiC bulk substrates. The obtained results show the capabilities of such composite devices, providing HEMT device electrical and small signal microwave performance similar to those obtained currently on bulk single crystal SiC substrates. The composite substrate approach appears as very promising for applications requiring low cost microwave power devices, such as mobile communications.\",\"PeriodicalId\":436391,\"journal\":{\"name\":\"2007 European Microwave Integrated Circuit Conference\",\"volume\":\"152 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-12-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 European Microwave Integrated Circuit Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMICC.2007.4412657\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 European Microwave Integrated Circuit Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMICC.2007.4412657","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
AlGaN/GaN HEMTs on epitaxies grown on composite substrate
In this paper, arc presented the first results obtained from AlGaN/GaN HEMTs devices processed on both MBE and MOCVD epitaxial structures grown on "composite" substrates. These substrates are based on innovative structures in which a thin Si or SiC single crystal layer is transferred on top of a thick polycrystalline SiC wafer with a thin SiO2 intermediary insulating layer. The fabrication of the transistors is based on the process flow developed by "TIGER" for HEMT epitaxy on SiC bulk substrates. The obtained results show the capabilities of such composite devices, providing HEMT device electrical and small signal microwave performance similar to those obtained currently on bulk single crystal SiC substrates. The composite substrate approach appears as very promising for applications requiring low cost microwave power devices, such as mobile communications.