{"title":"用BCB材料键合linbo3 -硅","authors":"Jinxin Cheng, Weiguo Liu, Huan Liu","doi":"10.1109/3M-NANO.2012.6472990","DOIUrl":null,"url":null,"abstract":"Adhesive wafer bonding is a bonding approach using an intermediate layer for bonding (e.g. glass, polymers, resists, polyimides). This paper presents results on adhesive bonding using spin-on Benzocyclobutene(BCB) from Dow Chemicals. The advantages of using adhesive bonding for MEMS applications will be illustrated by presenting a technology of fabricating LiNbO3-on-Si substrates. By changing the rotational speed of spin coating and BCB thickness, bonding temperature, hold temperature, bonding pressure, and other parameters, we carried out a series of process optimization experiment. Finally the bonding shear strength was tested. The results show that LiNbO3 and silicon has a good bonding strength under the bonding conditions at 200°C. This process will allow us the hybrid integrated manufacturing of SAW devices.","PeriodicalId":134364,"journal":{"name":"2012 International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"The bonding of LiNbO3-silicon via BCB material\",\"authors\":\"Jinxin Cheng, Weiguo Liu, Huan Liu\",\"doi\":\"10.1109/3M-NANO.2012.6472990\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Adhesive wafer bonding is a bonding approach using an intermediate layer for bonding (e.g. glass, polymers, resists, polyimides). This paper presents results on adhesive bonding using spin-on Benzocyclobutene(BCB) from Dow Chemicals. The advantages of using adhesive bonding for MEMS applications will be illustrated by presenting a technology of fabricating LiNbO3-on-Si substrates. By changing the rotational speed of spin coating and BCB thickness, bonding temperature, hold temperature, bonding pressure, and other parameters, we carried out a series of process optimization experiment. Finally the bonding shear strength was tested. The results show that LiNbO3 and silicon has a good bonding strength under the bonding conditions at 200°C. This process will allow us the hybrid integrated manufacturing of SAW devices.\",\"PeriodicalId\":134364,\"journal\":{\"name\":\"2012 International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)\",\"volume\":\"42 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/3M-NANO.2012.6472990\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/3M-NANO.2012.6472990","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Adhesive wafer bonding is a bonding approach using an intermediate layer for bonding (e.g. glass, polymers, resists, polyimides). This paper presents results on adhesive bonding using spin-on Benzocyclobutene(BCB) from Dow Chemicals. The advantages of using adhesive bonding for MEMS applications will be illustrated by presenting a technology of fabricating LiNbO3-on-Si substrates. By changing the rotational speed of spin coating and BCB thickness, bonding temperature, hold temperature, bonding pressure, and other parameters, we carried out a series of process optimization experiment. Finally the bonding shear strength was tested. The results show that LiNbO3 and silicon has a good bonding strength under the bonding conditions at 200°C. This process will allow us the hybrid integrated manufacturing of SAW devices.
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