低能离子注入Ge和SiGe的分子动力学模拟

M. Yu, Qiang Li, Jie Yang, Yingxin Qiao, Jinyan Wang, Ru Huang, Xing Zhang
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摘要

我们利用二项分布建立了描述Si 1-x Ge x衬底的结构,从而可以基于分子动力学方法模拟离子注入Ge和Si 1-x Ge x的过程。ZBL势用于描述注入离子与靶原子之间的相互作用。采用David Cai的电子停止功率模型计算注入离子与电子之间的碰撞。硼注入纯Ge和Si 1-x Ge x的结果与SIMS数据进行了比较。研究了表面溅射和后向散射导致的通量损失现象。本文还介绍了影响范围轮廓和通量损失的因素,包括Ge分数和种植体倾斜。这个电子文档是一个“实时”模板。论文的各个组成部分[标题,正文,标题等]已经在样式表中定义,如本文档中给出的部分所示。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Simulation on Low Energy Ion Implantation into Ge and SiGe With Molecular Dynamics Method
Using binomial distribution, we have created a structure to describe Si 1-x Ge x substrate, so ion implantation into Ge and Si 1-x Ge x can be simulated based on Molecular dynamics method. ZBL potential is applied to describe interaction between implanted ion and target atoms. David Cai's electronic stopping power model is applied to calculate collision between implanted ion and electronics. The results of boron implantation into pure Ge and Si 1-x Ge x are compared with SIMS data. The phenomenon of fluence loss due to surface sputtering and backscattering is investigated. Factors affecting range profile and fluence loss including Ge fraction and implant tilt is also presented in this paper.This electronic document is a "live" template. The various components of your paper [title, text, heads, etc.] are already defined on the style sheet, as illustrated by the portions given in this document.
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