通过交流电流加热尖端样品纳米接触的2ω信号测量在硅P-N结上的热功率谱

Kyeongtae Kim, Jisang Park, Sun Ung Kim, O. Kwon, Joon-Sik Lee, Seung-ho Park, Y. Choi
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引用次数: 0

摘要

纳米分辨率热功率谱分析在纳米结构高ZT热电材料的开发和纳米电子器件的掺杂密度谱分析中有着重要的应用。作者提出了一种新的交流热功率测量技术,并通过简单的实验装置进行了验证。在不受内置电位和光电离效应噪声影响的情况下,逐点测量了硅p-n结每10 nm的热功率分布,并与理论结果进行了比较。这种新型的交流热功率测量技术虽然不能跟踪p-n结附近理论热功率的急剧变化,但可以识别出p-n结损耗层热功率分布的平滑峰值
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermopower Profiling Across a Silicon P-N Junction Through the 2ω Signal Measurement of AC Current-Heated Tip-Sample Nano-Contact
Thermopower profiling with nanometer resolution has important applications in the development of nano-structured high ZT thermoelectric materials and in dopant density profiling of nanoelectronic devices. The authors suggested a new AC type thermopower measurement technique and demonstrated it with a simple experimental setup. Thermopower distribution across a silicon p-n junction was measured point-by-point at every 10 nm free from the noises due to built-in potential and photo-ionization effect and compared with theoretical result. Although this new AC type thermopower measurement technique could not follow the sharp variation of the theoretical thermopower near the p-n junction, it could identify a smooth peak of thermopower distribution in the depletion layer of the p-n junction
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