Zhiqian Zhao, Yongliang Li, Guilei Wang, Yan Li, Wenwu Wang
{"title":"在新型三层应变松弛缓冲材料上生长高结晶质量的Si0.5 Ge0.5层","authors":"Zhiqian Zhao, Yongliang Li, Guilei Wang, Yan Li, Wenwu Wang","doi":"10.1109/EDSSC.2019.8754356","DOIUrl":null,"url":null,"abstract":"A novel three-layer graded SiGe strain relaxed buffer, whose Ge concentration increased from bottom to top by roughly 10% with an in-situ annealing after each layer grown, is developed to effectively constrain the threading dislocation and attain a high crystalline quality of Si<inf>0.5</inf> Ge<inf>0.5</inf> layer. Moreover, a chemical mechanical planarization step can be applied to the strain relaxed buffer to further improve the surface roughness and crystalline quality of Si<inf>0.5</inf> Ge<inf>0.5</inf> layer. So, a high crystal quality and atomically smooth surface Si<inf>0.5</inf> Ge<inf>0.5</inf> layer can be successfully realized. Meanwhile, this novel three-layer graded SiGe strain relaxed buffer also can increase the critical thickness of Si<inf>0.5</inf> Ge<inf>0.5</inf> from less than 20nm to at least 50 nm and attain 0.6% compressive strain for Si<inf>0.5</inf> Ge<inf>0.5</inf> layer by utilizing the scanning moiré fringe imaging technique.","PeriodicalId":183887,"journal":{"name":"2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"High Crystalline Quality of Si0.5 Ge0.5 Layer Grown on a Novel Three-layer Strain Relaxed Buffer\",\"authors\":\"Zhiqian Zhao, Yongliang Li, Guilei Wang, Yan Li, Wenwu Wang\",\"doi\":\"10.1109/EDSSC.2019.8754356\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel three-layer graded SiGe strain relaxed buffer, whose Ge concentration increased from bottom to top by roughly 10% with an in-situ annealing after each layer grown, is developed to effectively constrain the threading dislocation and attain a high crystalline quality of Si<inf>0.5</inf> Ge<inf>0.5</inf> layer. Moreover, a chemical mechanical planarization step can be applied to the strain relaxed buffer to further improve the surface roughness and crystalline quality of Si<inf>0.5</inf> Ge<inf>0.5</inf> layer. So, a high crystal quality and atomically smooth surface Si<inf>0.5</inf> Ge<inf>0.5</inf> layer can be successfully realized. Meanwhile, this novel three-layer graded SiGe strain relaxed buffer also can increase the critical thickness of Si<inf>0.5</inf> Ge<inf>0.5</inf> from less than 20nm to at least 50 nm and attain 0.6% compressive strain for Si<inf>0.5</inf> Ge<inf>0.5</inf> layer by utilizing the scanning moiré fringe imaging technique.\",\"PeriodicalId\":183887,\"journal\":{\"name\":\"2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDSSC.2019.8754356\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDSSC.2019.8754356","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
High Crystalline Quality of Si0.5 Ge0.5 Layer Grown on a Novel Three-layer Strain Relaxed Buffer
A novel three-layer graded SiGe strain relaxed buffer, whose Ge concentration increased from bottom to top by roughly 10% with an in-situ annealing after each layer grown, is developed to effectively constrain the threading dislocation and attain a high crystalline quality of Si0.5 Ge0.5 layer. Moreover, a chemical mechanical planarization step can be applied to the strain relaxed buffer to further improve the surface roughness and crystalline quality of Si0.5 Ge0.5 layer. So, a high crystal quality and atomically smooth surface Si0.5 Ge0.5 layer can be successfully realized. Meanwhile, this novel three-layer graded SiGe strain relaxed buffer also can increase the critical thickness of Si0.5 Ge0.5 from less than 20nm to at least 50 nm and attain 0.6% compressive strain for Si0.5 Ge0.5 layer by utilizing the scanning moiré fringe imaging technique.