双向脉冲电源参数对印刷电路板镀铜的影响

Shoutao Wang, Wenguang Chen, Zhijian Liu, Caiyi Wei, Yuanyuan Peng
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引用次数: 0

摘要

印刷电路板是电子工业中最重要的基础电子元件,镀铜技术广泛应用于印刷电路板制造领域。脉冲电镀比直流电镀更高效环保,脉冲电镀的镀层更均匀细致。采用自行研制的双向脉冲电源,研究了双向脉冲电源参数对印刷电路板表面镀铜效果的影响。实验结果表明,双向脉冲电源的频率、正反脉冲占空比和电流密度对镀铜效果有一定的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of parameters of bidirectional pulse power supply on copper plating on printed circuit board
Printed circuit boards are the most important basic electronic components in the electronics industry, and copper plating technology is widely used in the field of printed circuit board manufacturing. Pulse plating is more efficient and environmentally friendly than DC plating, and the plating layer of pulse plating is more uniform and detailed. The effect of bi-directional pulse power supply parameters on the copper plating effect of printed circuit board surface was investigated by using a self-developed bidirectional pulse power supply. The experimental results show that the frequency, forward and reverse pulse duty cycle and current density of the bidirectional pulse power supply have certain effects on the copper plating effect.
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