cofire陶瓷电子封装制造物流

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium Pub Date : 1996-10-14 DOI:10.1109/IEMT.1996.559750

T. Carr

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引用次数: 0

摘要

利用化学动力学原理对cofire陶瓷引脚网格阵列(PGA)电子封装的制造周期进行了建模。本文讨论了化学反应的速率和机理与制造周期的关系。美铝电子封装已经使用这种方法，以实现世界一流的地位，在制造引脚网格阵列电子封装。

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The manufacturing logistics of cofire ceramic electronic packages

The manufacturing cycletime of cofire ceramic Pin Grid Array (PGA) electronic packages has been modeled using the principles of chemical kinetics. In this paper, the rates and mechanisms of chemical reactions are discussed in relation to the manufacturing cycletime. Alcoa Electronic Packaging has used this methodology to achieve world class status in the manufacturing of Pin Grid Array electronic packages.

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Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium

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